Product highlights: CAB-O-SIL ELM-150 fumed silica is a high purity fumed silica with a nominal nitrogen BET surface area of 160 m2/g. The product is designed for use in dispersion and slurry formulations used to polish silicon wafers/semiconductors for IC fabrication. CAB-O-SIL ELM-150 fumed silica is characterized by: - High chemical purity
- Narrow surface area range
- Narrow particle size distribution
- Low lot to lot variation
- High product consistency
Key application: Chemical Mechanical Planarization (CMP): Since the mid-1990s, the use of CMP has grown rapidly in semiconductor manufacturing. As a polishing technique, CMP facilitates smooth, clean, and planar surfaces by utilizing carefully formulated and controlled dispersions of fumed metal oxides, and other particles, in conjunction with specially designed equipment and polishing pads. The polishing process precisely removes excess build-up of dielectric insulation (oxide) and tungsten (plugs and vias <500 nm) that occur during the semiconductor manufacturing process. Specifically, formulating fumed silica dispersions and slurries with CAB-O-SIL ELM-150 product enables planarity and erosion control with high removal rate during tungsten CMP processes. Performance benefits :Dispersions and slurries designed for the precise and highly controlled CMP process require fumed silicas that are specifically engineered and consistently manufactured to enable CMP formulations to: - Optimize the polishing/removal rate
- Deliver planarity and uniformity across the silicon wafer
- Minimize polishing defects (micro-scratching/LPCs) and erosion
- Minimize contaminant metals
- Deliver uniform and consistent lot-to-lot performance
- Lower Cost of Ownership along the fabrication channel
Information provided by Cabot Corporation |
