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Master Bond adhesives
Rogers Corporation Theta® MCL-HE-679G Laminate, GHA-679G Prepreg Halogen-Free, Low Dielectric Constant, High heat Resistant Multi-Layer Circuit Material
Categories: Polymer

Material Notes: Theta® circuit materials are halogen free and have good dielectric characteristics suitable for high speed digital applications. Theta materials, in part due to their superior heat resistance, have proven to be extremely reliable through lead free processing and in high layer count HDI design requiring sequential laminations.

Features and Benefits:

  • Low insertion loss - Improved signal integrity
  • Improved thermal characteristics - High Tg, suitable for lead free processing
  • Superior thermal/mechanical reliability - Z-axis CTE 30% lower than standard FR-4
  • Enhanced design flexibility - wide range of laminate and prepreg thickness options
  • Halogen free - Environmentally friendly chemistry with no sacrifice to thermal, mechanical or electrical performance

Information provided by Rogers Corporation.

Vendors:
Available Properties
  • Water Absorption, IPC-TM-650 2.6.2.1, E-24/50 and D-24/23
  • Peel Strength, IPC-TM-650 2.4.8, Copper; 1/2 EDC foil (18 micron); Condition A
  • Dielectric Constant, IPC-TM-650 2.5.5.5, Z direction
  • Dielectric Constant, JPCA-TM001, Z direction
  • Dissipation Factor, JPCA-TM001, Z direction
  • Dissipation Factor, IPC-TM-650 2.5.5.5, Z direction
  • CTE, linear, IPC-TM-650 2.4.24, Z-Direction
  • CTE, linear, IPC-TM-650 2.4.24, Z-Direction
  • Glass Transition Temp, Tg, IPC-TM-650 2.4.24, TMA
  • Decomposition Temperature, IPC-TM-650 2.3.40, TGA; 5% weight loss
  • Flammability, UL94
  
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Plastic

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