LORD Chemlok®258XN adhesive is a non-conductive, one-coat adhesive that will bond unvulcanized rubber compounds to metal or other dissimilar rubber compounds. It is composed of a mixture of polymers, organic compounds and mineral fillers dissolved or dispersed in an organic solvent system. Chemlok 258XN adhesive is ideal of use in electrical component applications. A single coat of Chemlok 258XN adhesive will bond compounds based on natural rubber (NR), polyisoprene (IR), styrene-butadiene (SBR), polybutadiene (BR), polychloroprene (CR), nitrile (NBR), butyl (IIR) and EPDM polymers to metals. These metals include carbon and alloy steels, stainless steel, aluminum, copper and copper alloys, magnesium and zinc, as well as a variety of plastics, epoxy and vinyl ester. Features and Benefits: formulated without carbon black for use in electrical applications. provides superior adhesive performance without ozone depleting solvents. requires only a single coat for most applications, reducing labor, solvent usage, inventory and shipping costs. All information provided by Lord. |