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Chemically Resistant adhesives
Epoxy Technology EPO-TEKĀ® ED1021 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Preliminary Product Information Sheet

Material Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its ability to achieve high thermal conductivity values at low cure temperatures and a very shiny silver appearance which enhances overall LED brightness. Other benefits include long pot-life, low viscosity and high thixotropy making it ideal for wafer level stamping as well as syringe dispensing.

Information Provided by Epoxy Technology

Vendors:
Available Properties
  • Specific Gravity
  • Particle Size
  • Viscosity, 100 rpm
  • Viscosity, 10 rpm
  • Viscosity, 1 rpm
  • Ionic Impurities - Na (Sodium)
  • Ionic Impurities - K (Potassium)
  • Ionic Impurities - Cl (Chloride)
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Volume Resistivity
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg
  • Decomposition Temperature, Degradation Temperature
  • Cure Time
  • Pot Life
  • Shelf Life
  
Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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Chemically Resistant adhesives
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