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Chemically Resistant adhesives
Epoxies, Etc 20-2183 Polyurethane Potting & Encapsulating Resin
Categories: Polymer; Thermoset; Polyurethane, TS

Material Notes: Description: This polyurethane is engineered for electronic potting, encapsulating, and casting applications. It is low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. This elastomeric system is suitable for a variety of electronic insulating applications. A key feature of this product is the quick demolding time of 1 Hour for encapsulating or casting. 20-2183 is a faster gelling version of 20-2180.

Green: The base Natural Oil Polyol (NOP) used in this system is obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP’s, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide.

Features:

  • 1 Hour Demolding
  • Green
  • Low Viscosity
  • Available in TriggerBond®
  • Low Durometer
  • Moisture Resistant
  • Low Shrinkage & Exotherm
Benefits:
  • Need fewer molds for production
  • Reduce demand on non-renewable fossil fuels
  • Quick self leveling around components
  • Easy to use packaging
  • Low stress on components & vibration resistant
  • Can be used in wet environments
  • Less stress to components during cure

Information provided by Epoxies, Etc

Vendors:
Available Properties
  • Specific Gravity, Polyol Resin
  • Specific Gravity, Isocyanate
  • Viscosity, Isocyanate
  • Viscosity, Mixed
  • Viscosity, Polyol Resin
  • Storage Temperature
  • Elongation at Break
  • Tear Strength
  • Volume Resistivity
  • Surface Resistance
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • CTE, linear
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time, Demold Time
  • Cure Time
  • Cure Time
  • Gel Time
  
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Category Notes
Plastic

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Chemically Resistant adhesives
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