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Master Bond adhesives
Lord Adhesives CoolTherm™ 6028/6029 Encapsulant System
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes: LORD CoolTherm™ EP-6028/6029 encapsulant is a two-component epoxy system used for potting high voltage transformers, specifically units designed for high temperature service. CoolTherm EP-6028/6029 encapsulant provides a rigid epoxy system for use in applications where thermal shock is expected.

Features: provides excellent resistance to thermal shock, mechanical shock, and high humidity conditions. can be used on parts and devices that experience operating temperatures from -55°C to +155°C. exhibits minimal exotherm, allowing pour of very large castings with minimal stress on the unit. exceeds requirements of Military Specification/Standard A-A-59877.

All information provided by Lord.
Vendors:
Available Properties
  • Specific Gravity, cured, all components
  • Water Absorption
  • Viscosity, EP-6029 Hardener
  • Viscosity, Mixed
  • Viscosity, EP-6028 Resin
  • Hardness, Shore D, cured
  • Tensile Strength, cured
  • Volume Resistivity, ASTM D 257, cured
  • Dielectric Constant, cured
  • Dielectric Strength, cured
  • Dissipation Factor, cured
  • CTE, linear, ASTM C864
  • Thermal Conductivity, cured
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Working Life, Mixed
  • Gel Time, mixed
  • Shelf Life, each component from date of manufacture
  
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Manufacturer Notes:
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Category Notes
Plastic

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