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Sumitomo Bakelite Phenolics
Loctite® 3860 Thermally Conductive Potting
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes:
Potters and Thermally Conductive Bonders
Loctite® Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips, while providing the most efficient thermal transfer between transistors or microprocessors and their heat sinks. Loctite offers a wide range of adhesive chemistries including silicones, acrylics and epoxies. Many processing options are available for curing these adhesives such as heat cure, activator cure, and UV light.

Loctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.

For electronics assembly, Loctite offers deep potting, high adhesion, non-corrosive, and thermally conductive potting products. These can be cured with heat, UV light, or moisture.

Loctite® 3860 Thermally Conductive Potting
A thermally conductive, room temperature curing, potting compound for general applications requiring thermal conductivity. Cure Type: Heat Bonding Type: 2-part epoxy (100:9.5)

Vendors:
Available Properties
  • Viscosity, Mixed
  • Hardness, Shore D
  • CTE, linear
  • Glass Transition Temp, Tg
  • Cure Time, 65ºC
  • Cure Time, 25ºC
  • Pot Life
  • Gel Time
  
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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Sumitomo Bakelite Phenolics
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