Henkel Loctite® ECCOBOND E 1172 A Epoxy

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Henkel Loctite® ECCOBOND E 1172 A Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Tan Cure: Heat Cure Product Benefits: One component Fast cure at low temperatures Low cure temperature Void-free underfill Low CTE Non-anhydride curing chemistry Long pot life Application: Underfill Typical Package Application: Flip chip devices LOCTITE ECCOBOND E 1172 A is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can underfill devices with 25 micron geometries. LOCTITE ECCOBOND E 1172 A provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects. Information provided by Loctite®
Vendors:

Available Properties
Density Filler Content Moisture Absorption, Cured, 24-hr boil Particle Size Brookfield Viscosity, Uncured, Spindle 3, speed 5 rpm Hardness, Shore D, Cured Volume Resistivity Dielectric Constant Dissipation Factor CTE, linear, Cured Glass Transition Temp, Tg, Cured Shrinkage, on Cure Cure Time, Fast Cure Cure Time, Standard Cure Cure Time, plus 5 minutes @ 135 °C, Low Stress Cure

Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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