Appearance: Pink Filler Type: Boron Nitride Cure: Skip-Cure Process or Heat Cure Product Benefits: - Electrically non-conductive
- Hydrophobic
- Stable at high temperatures
- Void-free bondline
- Excellent interfacial adhesion strength
- Good resistance to "popcorning" after exposure to reflow temperatures
- Excellent dielectric properties
Application: Die attach Typical Package Application: PBGA, Array packages, Tape packs and CSP Typical Applications: Heat sinks, Heat slugs and Flip Chip Surface Finishes: Solder Mask, BT, FR, Au, Silicon, Polyimide, Kapton™, Palladium, Alloy 42 and Mylar™ LOCTITE ABLESTIK QMI536HT die attach paste was designed to attach integrated circuits and components to advanced substrates. Information provided by Loctite® |