Cookson Group STAYCHIP® 3090.mk.01 High Productivity Capillary Underfill

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Cookson Group STAYCHIP® 3090.mk.01 High Productivity Capillary Underfill (discontinued **)
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	STAYCHIP 3090 is a highly filled, high reliability capillary underfill designed for high productivity flip applications. This material merges excellent stability with fast cure speed, fast flow times, and exceptional reliability performance. The reactivity of Staychip 3090 allows shipment of material in bulk quantities up to 20 ounce cartridges and storage in a conventional refrigerator at 5°C. Features: 5°C storage Long pot life Non-anhydride formulation Capable to package in large containers to minimize syringe change out Excellent adhesion (even after exposure to high humidity, pressure and temperature) Fast, efficient flow properties High filler loading while maintaining fast flow properties Exceptional reliability in JEDEC testing Proprietary filler technology Information provided by Cookson Electronics
Vendors:

Available Properties
Specific Gravity, ASTM D 1475-60 Filler Content Moisture Absorption at Equilibrium, 2 hour boil Particle Size Brookfield Viscosity, Brookfield #51 at 10 RPM Storage Temperature Hardness, Shore D, ASTM D 2240 Fracture Toughness CTE, linear, Alpha 1 CTE, linear, Alpha 2 Glass Transition Temp, Tg, By DSC Flash Point, ASTM D 93-85 Pot Life Shelf Life, at 5°C

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

**
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