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Master Bond adhesives
Lord Adhesives Metech 3505 Palladium Silver Conductor Composition
Categories: Polymer; Adhesive

Material Notes: Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide processing parameters and is optimized for use with high speed printing equipment. Fired conductor exhibits high initial and aged adhesion values and readily accepts tin lead and tin lead silver solders.

All information provided by Lord.

Vendors:
Available Properties
  • Viscosity
  • Thickness, Fired
  • Surface Resistivity per Square
  • Shelf Life
  
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Plastic

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