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Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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Lucas-Milhaupt CDA 101 Certified OFHC (Oxygen Free High Conductivity Copper) (ASTM B170 Grade 1)
Categories: Metal; Nonferrous Metal; Copper Alloy; Solder/Braze Alloy; Pure Element

Material Notes: Certified OFHC is a fluid filler metal used for the brazing of ferrous and nickel based alloys especially when brazing steel, stainless steel, and copper-nickel alloys. This alloy is typically used in a furnace braze applications without the use of flux where high purity copper filler metal is required. Certified OFHC is a free flowing filler metal that exhibits good wetting characteristics on ferrous and nickel based materials.

Available forms: Wire, strip, engineered preforms, specialty preforms.

Information provided by Lucas-Milhaupt.

Key Words: ASTM F68; AWS A5.8M/A5.8 BVCu-1x
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 8.94 g/cc
Density 0.323 lb/in³
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000171 ohm-cm101% IACS
 
Thermal PropertiesOriginal ValueComments
Melting Point 1981 °F
Solidus 1981 °F
Liquidus 1981 °F
 
Processing PropertiesOriginal ValueComments
Processing Temperature 2000 - 2100 °FBrazing Range
 
Component Elements PropertiesOriginal ValueComments
Antimony, Sb <= 0.00040 %
Arsenic, As <= 0.00050 %
Bismuth, Bi <= 0.00010 %
Cadmium, Cd <= 0.00010 %
Copper, Cu >= 99.99 %
Iron, Fe <= 0.0010 %
Lead, Pb <= 0.0050 %
Manganese, Mn <= 0.000050 %
Nickel, Ni <= 0.0010 %
Oxygen, O <= 0.00050 %
Phosphorus, P <= 0.00030 %
Selenium, Se <= 0.00030 %
Silver, Ag <= 0.0025 %
Sulfur, S <= 0.0015 %
Tellurium, Te <= 0.00020 %
Tin, Sn <= 0.00020 %
Zinc, Zn <= 0.00010 %
 
Descriptive Properties
ColorCopper

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NLUCM9810 / 254756

solder replacement adhesives

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