Henkel Loctite® ABLESTIK 8387BS Epoxy

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Henkel Loctite® ABLESTIK 8387BS Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black Product Benefits: Non-conductive Black pigmentation for blocking stray light 30µm polymer spacers for bondline thickness control Cure: Heat cure Application: Die attach LOCTITE ABLESTIK 8387BS single component adhesive is designed for high throughput bonding applications. It contains spacers for improved bondline control. Information provided by Loctite®
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Physical Properties	Metric	English	Comments

Brookfield Viscosity	14250 cP	14250 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Metric	English	Comments
Tensile Modulus	0.0750 GPa @Temperature 250 °C	10.9 ksi @Temperature 482 °F	Cured, DMTA
	0.0870 GPa @Temperature 200 °C	12.6 ksi @Temperature 392 °F	Cured, DMTA
	0.118 GPa @Temperature 150 °C	17.1 ksi @Temperature 302 °F	Cured, DMTA
	0.790 GPa @Temperature 100 °C	115 ksi @Temperature 212 °F	Cured, DMTA
	1.919 GPa @Temperature 25.0 °C	278.3 ksi @Temperature 77.0 °F	Cured, DMTA
	3.529 GPa @Temperature -65.0 °C	511.8 ksi @Temperature -85.0 °F	Cured, DMTA

Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	122 °C	252 °F	Cured, TMA

Processing Properties	Metric	English	Comments
Cure Time	1.50 min @Temperature 90.0 °C	0.0250 hour @Temperature 194 °F	Alternate Cure Schedule
	60.0 min @Temperature 100 °C	1.00 hour @Temperature 212 °F
Working Life	2880 min	2880 min
Shelf Life	12.0 Month	12.0 Month	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10		Cured, Sodium (Na+)
	<10		Cured, Potassium (K+)
	<50		Cured, Chloride (Cl-)
Shear Strength	>14 kg-f		Die, 3 X 3 mm Si die, Ag/Cu Leadframe
Thixotropic Index	>4.5		Uncured, 0.5/5 rpm
Weight Loss (%)	0.59		Cured Paste, Cured, @ 300ºC
	0.74		Wet Paste, Cured, @ 300ºC

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PLOCT5032 / 255243

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