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Metal adhesives

Master Bond EP3HTS-TC One component, silver filled epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Electrically Conductive; Epoxy, Thermally Conductive

Material Notes: Key Features:
  • For bonding, sealing and coating
  • Not premixed and frozen
  • Very long open time at room temperature
  • Cures rapidly at 250 to 300°F
Product Description: Master Bond EP3HTS-TC is a fast curing, silver filled, one part epoxy with unparalleled electrical and thermal conductivity. It is not premixed and frozen and has an unlimited working life at room temperature. It has a paste consistency and dispenses easily from a syringe. It cures rapidly at 250 to 300°F with minimal flow and low shrinkage upon curing. This epoxy should be stored in a refrigerator at 40 to 50°F. Although this product can be used for sealing and coating, its main use is as an adhesive for die attach and general bonding purposes. EP3HTS-TC bonds well to a wide variety of substrates including metals, composites, ceramics, and many plastics. As a die attach adhesive, it dispenses smoothly and easily. It is well suited for automatic dispensing equipment and can be applied without any tailing. For other types of bonding, it combines remarkable thermal and electrical conductivity. In fact, the thermal conductivity exceeds 16 W/(m-k). Along with this, the maximum particle size is about 20 microns, and when these numbers are combined, the thermal resistance is a remarkable 1-5 x 10¯6 K-m2/W. Other desirable attributes include excellent dimensional stability, resistance to thermal cycling, and a low coefficient of thermal expansion. The temperature range is -80°F to +400°F. EP3HTS-TC also passes NASA low outgassing specifications. There are 2 scenarios where EP3HTS-TC would be a top candidate. The first is in applications where the lowest possible volume resistivity is required. The second is when pre-eminent thermal conductivity is necessary and the need for electrical conductivity is not a pertinent issue.

Product Advantages:

  • Single component system, no mixing needed
  • Not premixed and frozen, unlimited working life
  • Ideal viscosity for die attach and general bonding
  • Spectacular electrical and thermal conductivity
  • NASA low outgassing

Information provided by Master Bond.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesMetricEnglishComments
Specific Gravity 4.45 g/cc4.45 g/cc
Solids Content 100 %100 %
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 60 - 7060 - 70
Tensile Strength 13.8 - 20.7 MPa2000 - 3000 psi
Tensile Modulus 1.03 - 1.38 GPa150 - 200 ksi
Adhesive Bond Strength 4.14 - 5.52 MPa600 - 800 psiTensile lap shear, Al to Al
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 0.001 ohm-cm0.001 ohm-cm
 
Thermal PropertiesMetricEnglishComments
CTE, linear 20.0 - 23.0 µm/m-°C11.1 - 12.8 µin/in-°F
Thermal Conductivity 15.9 - 17.0 W/m-K110 - 118 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 204 °C400 °F
Minimum Service Temperature, Air -62.2 °C-80.0 °F
Glass Transition Temp, Tg 58.0 °C136 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  15.0 - 20.0 min
@Temperature 149 °C
0.250 - 0.333 hour
@Temperature 300 °F
Option 2 (add 1-2 hours at 250-300°F)
 30.0 - 40.0 min
@Temperature 121 °C
0.500 - 0.667 hour
@Temperature 250 °F
Option 1 (add 1-2 hours at 250-300°F)
Shelf Life 3.00 - 6.00 Month
@Temperature 4.44 - 10.0 °C
3.00 - 6.00 Month
@Temperature 40.0 - 50.0 °F
in original, unopened containers
 
Descriptive Properties
Colorsilver
Die shear strength9-12 kg-f2 x 2 mm
Thixotropic index10
Viscositythixotropic paste

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PMASTM5900 / 306789

Metal adhesives

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