Plansee Tungsten Sputtering Target

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Plansee Tungsten Sputtering Target
Categories:	Metal; Nonferrous Metal; Tungsten Alloy; Pure Element
Material Notes:	High purity, maximum density, and homogeneous microstructure. Tungsten layers are components of the thin-film transistors used in TFT-LCD screens. They are used wherever large screen formats, particularly high image definition and optimized contrasts are needed. Tungsten is also used as a diffusion barrier and a conductive connector in the microelectronics industry. At high temperatures, thin films made of materials with low melting points may diffuse and intermix with the adjacent layers. This does not happen with tungsten. This material has the highest melting point of all metals – as a result, tungsten layers are particularly stable. Information provided by PLANSEE.
Vendors:	PLANSEE SE: Whether it's high temperatures, aggressive chemicals or extreme mechanical loading: PLANSEE supplies a suitable product solution in refractory metals or composite materials. As the world market leader in powder metallurgically produced high performance materials we combine outstanding materials knowledge with profound applications and technology know-how. Visit us at www.plansee.com. Click here to view all available suppliers for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
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Physical Properties	Original Value	Comments

Density	>= 19.2 g/cc

Electrical Properties	Original Value	Comments
Electrical Resistivity	0.00000500 ohm-cm @Temperature 20.0 °C

Thermal Properties	Original Value	Comments
CTE, linear	4.60 µm/m-°C @Temperature 20.0 °C
Thermal Conductivity	170 W/m-K @Temperature 20.0 °C

Component Elements Properties	Original Value	Comments
Aluminum, Al	0.0015 %	<15 ppm by weight
Cadmium, Cd	0.00050 %	<5 ppm by weight
Carbon, C	0.0030 %	<30 ppm by weight
Copper, Cu	0.0010 %	<10 ppm by weight
Iron, Fe	0.0030 %	<30 ppm by weight
Lead, Pb	0.00050 %	<5 ppm by weight
Mercury, Hg	0.00010 %	<1 ppm by weight
Molybdenum, Mo	0.010 %	<100 ppm by weight
Nickel, Ni	0.0020 %	<20 ppm by weight
Nitrogen, N	0.00050 %	<5 ppm by weight
Oxygen, O	0.0020 %	<20 ppm by weight
Silicon, Si	0.0010 %	<10 ppm by weight
Tungsten, W	>= 99.97 %

Descriptive Properties
Purity	>99,97%

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NPLAM971 / 249325

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