Henkel Loctite® ABLESTIK 8008HT Adhesive

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Henkel Loctite® ABLESTIK 8008HT Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Silver Product Benefits: Electrically conductive Thermally conductive Snap curable after B-stage Low modulus Stencil printing Void-free bondline without bleed Cure: Heat cure Application: Die attach LOCTITE ABLESTIK 8008HT adhesive is designed for high power devices in high UPH environment. It offers a lead-free alternative to soft solder and eutectic and can potentially reduce the layers of backside metallization required. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008HT should be used with a pressure sensitive dicing tape and is not compatible with UV dicing Information provided by Loctite®
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Physical Properties	Metric	English	Comments

Moisture Absorption	0.530 %	0.530 %	Saturation, after 85% RH exposure
pH	4.1	4.1
Brookfield Viscosity	50000 cP	50000 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Metric	English	Comments
Tensile Modulus	2.451 GPa @Temperature 250 °C	355.5 ksi @Temperature 482 °F	Cured, DMTA
	3.161 GPa @Temperature 200 °C	458.5 ksi @Temperature 392 °F	Cured, DMTA
	3.821 GPa @Temperature 150 °C	554.2 ksi @Temperature 302 °F	Cured, DMTA
	6.662 GPa @Temperature 25.0 °C	966.2 ksi @Temperature 77.0 °F	Cured, DMTA
	9.703 GPa @Temperature -65.0 °C	1407 ksi @Temperature -85.0 °F	Cured, DMTA

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.000060 ohm-cm	0.000060 ohm-cm

Thermal Properties	Metric	English	Comments
CTE, linear	37.0 µm/m-°C	20.6 µin/in-°F	Cured, Below Tg
	62.0 µm/m-°C	34.4 µin/in-°F	Cured, Above Tg
Thermal Conductivity	11.0 W/m-K	76.3 BTU-in/hr-ft²-°F	Cured
Glass Transition Temp, Tg	264 °C	507 °F	Cured, TMA

Processing Properties	Metric	English	Comments
Cure Time	30.0 min	0.500 hour	ramp to 175°C + 60 minutes @ 175°C, Air box oven Cure
	0.330 min @Temperature 170 °C	0.00550 hour @Temperature 338 °F	Recommended Snap Cure Condition
Working Life	1440 min	1440 min
Shelf Life	12.0 Month @Temperature -40.0 °C	12.0 Month @Temperature -40.0 °F	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10		Cured, Chloride (Cl-)
	<10		Cured, Sodium (Na+)
	<10		Cured, Potassium (K+)
Shear Strength	2.6 kg-f		Die, 2 x 2 mm Si die on Ag/Cu LF @ 260°C
	6 kg-f		Die, 2 x 2 mm Si die on Ag/Cu LF @ 25°C
Thixotropic Index	4		Uncured, 0.5/5 rpm
Water Extract Conductivity	15 µmhos/cm		Cured

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

PLOCT5024 / 255235

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