Henkel Loctite® ABLESTIK 8290 Epoxy

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Henkel Loctite® ABLESTIK 8290 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Silver Product Benefits: Low stress Improved JEDEC performance Low bleed Cure: Heat cure Application: Die attach Filler Type: Silver LOCTITE ABLESTIK 8290 electrically conductive die attach adhesive is designed for high reliability leadframe packaging applications. It is recommended for die sizes <200 mils for the best MRT performance Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	0.710 %	Saturation, after 85% RH exposure
Brookfield Viscosity	9000 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	117 MPa @Temperature 250 °C	Cured, DMTA
	138 MPa @Temperature 150 °C	Cured, DMTA
	3034 MPa @Temperature 25.0 °C	Cured, DMTA

Electrical Properties	Original Value	Comments
Volume Resistivity	0.0080 ohm-cm

Thermal Properties	Original Value	Comments
CTE, linear	81.0 µm/m-°C	Cured, Below Tg
	181 µm/m-°C	Cured, Above Tg
Thermal Conductivity	1.60 W/m-K	Cured
Glass Transition Temp, Tg	38.0 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	30.0 min	ramp to 175°C + 15 minutes @ 175°C
	30.0 min	ramp to 100°C, Alternate Cure Schedule
	15.0 min @Temperature 175 °C
	30.0 min @Temperature 100 °C	15 minute ramp from 100°C to 175°C, Alternate Cure Schedule
Working Life	24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Potassium (K+)
	<20	Cured, Sodium (Na+)
	<30	Cured, Chloride (Cl-)
Shear Strength	15 kg-f	Die, 2 x 2 mm Si die on Ag/Cu LF
Thixotropic Index	5.9	Uncured, 0.5/5 rpm
Weight Loss (%)	2.5	10 x 10 mm Si die on glass slide

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PLOCT5027 / 255238

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