Ensinger TECACOMP LCP LDS black 1014978 Liquid crystal polymer

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Ensinger TECACOMP LCP LDS black 1014978 Liquid crystal polymer
Categories:	Polymer; Thermoplastic; Liquid Crystal Polymer (LCP); Liquid Crystal Polymer (LCP), Unfilled
Material Notes:	developed for the LPKF-LDS® process low thermal expansion Target Industries: automotive industry electrical engineering LED lighting technology mechanical engineering former material REZ-RS-4107 Information provided by Ensinger Inc.
Vendors:	Ensinger High Performance Plastics withstand severe environments, resist harsh chemicals, and perform well in extreme temperatures. They offer weight savings that have potential to drive lower cost systems. Click here to view all available suppliers for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
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Physical Properties	Original Value	Comments

Density	1.75 g/cc
Water Absorption at Saturation	<= 0.10 %	50 % relative humidity up to saturation; DIN EN ISO 62
Linear Mold Shrinkage, Flow	0.0010 cm/cm	DIN EN ISO 294-4
Linear Mold Shrinkage, Transverse	0.0030 cm/cm	DIN EN ISO 294-4

Mechanical Properties	Original Value	Comments
Tensile Strength	93.0 MPa	DIN EN ISO 527-1
Elongation at Break	1.3 %	DIN EN ISO 527-1
Modulus of Elasticity	10.5 GPa	DIN EN ISO 527-1
Adhesive Bond Strength	9.10 MPa	test method: pull-off-test, (metal path)
Charpy Impact Unnotched	8.00 kJ/m²	DIN EN ISO 179-1eU

Electrical Properties	Original Value	Comments
Volume Resistivity	3.80e+13 ohm-cm	DIN EN 61340-2-3
Surface Resistance	4.10e+12 ohm	DIN EN 61340-2-3
Dielectric Constant	3.52 @Frequency 1e+9 Hz
Dissipation Factor	0.0030 @Frequency 1e+9 Hz
Comparative Tracking Index	275 V	DIN EN 60112

Thermal Properties	Original Value	Comments
CTE, linear, Parallel to Flow	16.0 µm/m-°C @Temperature 50.0 - 100 °C	DIN EN ISO 11359-1;2
	25.0 µm/m-°C @Temperature 100 - 150 °C	DIN EN ISO 11359-1;2
	30.0 µm/m-°C @Temperature 150 - 200 °C	DIN EN ISO 11359-1;2
	34.0 µm/m-°C @Temperature 200 - 250 °C	DIN EN ISO 11359-1;2
CTE, linear, Transverse to Flow	32.0 µm/m-°C @Temperature 50.0 - 100 °C	DIN EN ISO 11359-1;2
	40.0 µm/m-°C @Temperature 100 - 150 °C	DIN EN ISO 11359-1;2
	49.0 µm/m-°C @Temperature 150 - 200 °C	DIN EN ISO 11359-1;2
	60.0 µm/m-°C @Temperature 200 - 250 °C	DIN EN ISO 11359-1;2
Specific Heat Capacity	1.25 J/g-°C	DIN EN 821
Thermal Conductivity	0.760 W/m-K	through-plane; ISO 22007-4:2008
	1.61 W/m-K	in-plane; ISO 22007-4:2008
Melting Point	320 °C	DIN 53765
Maximum Service Temperature, Air	200 °C	long term
	260 °C	short term
Deflection Temperature at 1.8 MPa (264 psi)	274 °C	ISO-R 75 Method A
Flammability, UL94	V-0 @Thickness 3.00 mm	DIN IEC 60695-11-10

Processing Properties	Original Value	Comments
Processing Temperature	320 - 340 °C	Cylinder
Nozzle Temperature	350 °C
Zone 1	320 °C
Zone 2	325 °C
Zone 3	330 °C
Zone 4	340 °C
Melt Temperature	350 °C	Material temperature
Mold Temperature	160 °C
Drying Temperature	150 °C
Dry Time	3.00 - 5.00 hour
Moisture Content	<= 0.10 %	Permissible residual moisture content
Injection Pressure	150 MPa
Hold Pressure	30.0 - 60.0 MPa
Back Pressure	0.100 - 0.300 MPa

Descriptive Properties
Color	black
Injection rate	fast
Laser Marking Parameter	1.6-3.2 m/s	Forward movement
	100-200 KZ	Frequency
	2.5 W	Power
Thermal diffusivity	0.31 mm2/s	through-plane, ISO 22007-4:2008
	0.93 mm2/s	in-plane, ISO 22007-4:2008

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