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Copper Alloy, UNS C50705, H02 Temper, Flat Products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: 1/2 Hard

Excellent Suitability – Soldering, Capacity for Being Cold Worked, Capacity for Being Hot Formed; Good Suitability – Brazing, Gas Shielded Arc Welding, Spot Weld

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Physical PropertiesMetricEnglishComments
Density 8.89 g/cc0.321 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Vickers 23
@Load 0.500 kg
23
@Load 1.10 lb
Tensile Strength 490 MPa71000 psi
Tensile Strength, Yield 462 MPa67000 psi0.2% Offset
Elongation at Break 16 %16 %
Tensile Modulus 82.7 GPa12000 ksi
Modulus of Rigidity 31.0 GPa4500 ksi
Poissons Ratio 0.330.33Calculated
Machinability 20 %20 %
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000450 ohm-cm0.00000450 ohm-cm38% IACS
 
Thermal PropertiesMetricEnglishComments
Specific Heat Capacity 0.377 J/g-°C0.0900 BTU/lb-°F
Thermal Conductivity 13.9 W/m-K96.5 BTU-in/hr-ft²-°F
Melting Point 999 - 1080 °C1830 - 1976 °F
Solidus 999 °C1830 °F
Liquidus 1080 °C1976 °F
Annealing Point 450 - 550.0 °C
@Time 0.500 sec
842 - 1022 °F
@Time 0.000139 hour
 
Processing PropertiesMetricEnglishComments
Processing Temperature >= 225 °C>= 437 °FStress Relief
Hot-Working Temperature >= 764.4 °C>= 1408 °F
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu >= 96.5 %>= 96.5 %
Iron, Fe 0.10 - 0.40 %0.10 - 0.40 %
Lead, Pb <= 0.020 %<= 0.020 %
Phosphorus, P 0.040 - 0.15 %0.040 - 0.15 %
Tin, Sn 1.5 - 2.0 %1.5 - 2.0 %
Zinc, Zn <= 0.50 %<= 0.50 %
 
Descriptive Properties
Proportional Limit64 ksi
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC50705x1 / 292105

Specialty Compounds RTP Company

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