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Metal adhesives

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Master Bond EP17HTDM-2 Black One component, high temperature resistant die attach epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Key Features:
  • Convenient handling and processing
  • Resists temperatures up to +650°F
  • Thermally conductive, electrically insulating
  • Meets NASA low outgassing requirements
Master Bond EP17HTDM-2 Black is a one component, heat cured epoxy system that is used for bonding and sealing, as well as die attach applications. This flowable, high viscosity system, cures in 4-6 hours at 300°F or 2-3 hours at 350°F. Post curing at 400°F for 1-2 hours will optimize properties. EP17HTDM-2 Black has limited flow and low exotherm when curing, and it is compatible for die attach applications. This epoxy contains no solvents or diluents. EP17HTDM-2 Black bonds well to similar and dissimilar substrates such as metal, ceramics, plastics and composites. It is a superb electrical insulator with good thermal conductivity, even at elevated temperatures. The particle size of the thermally conductive filler is very small. This allows for exceptionally thin bond lines ranging from 5 to 15 microns. Having thinner bond lines translates to lower thermal resistance. The Tg is 190- 195°C. The compressive strength and tensile modulus are noted in the chart below. It is resistant to many chemicals including acids, bases, salts, fuels, oils and solvents. Its service temperature range is -80°F to +650°F. This epoxy uses EP17HTDM-2 Black should be considered for applications in aerospace, electronics, specialty OEM and related industries, where high temperature resistance, easy handling, and an array of physical strength properties are desirable.

Product Advantages:

  • Single component system; no mixing prior to use
  • High temperature resistance
  • Very good electrical insulation properties, even at higher temperatures
  • Ideal viscosity flow profile for die attaching
  • Good thermal conductivity
  • Excellent die shear strength

Information provided by Master Bond Inc.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.78 g/cc
Solids Content 100 %
Viscosity 600000 - 800000 cPthixotropic
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 85 - 95
Tensile Strength 10000 - 11000 psi
Tensile Modulus 750000 - 800000 psi
Compressive Strength 28000 - 30000 psi
Adhesive Bond Strength 2600 - 2800 psiTensile Lap Shear; Al/Al
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+15 ohm-cm
Dielectric Constant 4.3
@Frequency 60 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 20.0 - 22.0 µm/m-°C
Thermal Conductivity 9.00 - 10.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 316 °C
Minimum Service Temperature, Air -62.0 °C
Glass Transition Temp, Tg 190 - 195 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 - 3.00 hour
@Temperature 177 °C
Option 2. Post cure for 1-2 hours at 400°F recommended
 4.00 - 6.00 hour
@Temperature 149 °C
Option 1. Post cure for 1-2 hours at 400°F recommended
Shelf Life 3.00 - 6.00 Month
@Temperature 4.44 - 10.0 °C
 
Descriptive Properties
ColorBlack
Die shear strength24-27 kg-f2 x 2 mm [80 x 80 mil]
Typical thermal resistance12-15 x 10-6[K•m2/W]

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PMASTM600 / 248996

Metal adhesives

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