| CAS No.35948-25-5 Applications: As printed circuit board PCB epoxy flame retardant resin:Since GY-FR-DOP has more rigid structure and belong to the characteristics of the phosphorus system, thus produced phosphorus-containing epoxy resin has : - better flame retardance
- higher glass transition temperature
- Excellent thermal stability
- compare to traditional halogen-containing epoxy resin, it produces less toxic smoke
- applied to the printed circuit board (PCB) and electronic sheet with excellent fire effects
flame retardant thermoplastic polyester: good garbon ratio and flame retardant efficiency for PET. can give excellent thermal stability and flame resistance, produce less toxic fumes & corrosive gases, GY-FR-DOP ‘s phosphorus-containing groups located at molecular side chains into thermal cracking .
anti-discoloration agent for ABS resin:- GY-FR-DOP for ABS resin in the molding process can provide a great anti-fade resistance.
- Dosage of GY-FR-DOP for ABS resin in added is 0.1 ~ 1 phr , GYC Technology recommends 0.1 ~ 0.5 phr, within the scope of this addition is better. GY-FR-DOP and in combination with a hindered phenolic stabilizer such as BHT, sulfur compounds such as adenosine triphosphate DLTDP or the like, can provide an excellent effect.
As polypropylene heat stabilizer: When add GY-FR-DOP 0.1~ 0.2 phr to injection molding grade polypropylene, it can prevent thermal discoloration effectively.
Other flame retardant applications:- GY-FR-DOP’s reaction product and itaconic acid can be used as a reactive polymer fire retardant; GY-FR-DOP’s reaction product with bis (hydroxymethyl) – benzoguanamine polymers can be used as add-fire agent.
Information provided by Go Yen Chemical |
