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Ensinger PEI

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SABIC LNP™ THERMOCOMP™ Compound LC008EXQ Polyetheretherketone (PEEK)
Categories: Polymer; Thermoplastic; Polyketone; Polyetheretherketone (PEEK)

Material Notes: LNP THERMOCOMP LC008EXQ compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

Features: High Stiffness,Light-weight Structural,High Heat Resistance,Super Strong (Carbon Fiber Filled),Electrically Conductive,Easy Molding,Structural

Information provided by SABIC

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.44 g/ccASTM D792
Moisture Absorption 0.0500 %23°C/50% RH/24 hrs; ASTM D570
Linear Mold Shrinkage, Flow 0.0015 - 0.0030 cm/cm24hrs; ASTM D955
Linear Mold Shrinkage, Transverse 0.0070 - 0.014 cm/cm24hrs; ASTM D955
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 321 MPa5 mm/min; ISO 527
 330 MPa5 mm/min; ASTM D638
Elongation at Break 1.4 %5 mm/min; ISO 527
 1.5 %5 mm/min; ASTM D638
Tensile Modulus 40420 MPa1 mm/min; ISO 527
 41480 MPa5 mm/min; ASTM D638
Flexural Strength 460 MPaISO 178
 492 MPabrk, 1.3 mm/min, 50 mm span; ASTM D790
Flexural Modulus 33820 MPa2 mm/min; ISO 178
 35200 MPa1.3 mm/min, 50 mm span; ASTM D790
Compressive Strength 215 MPaSABIC method
Poissons Ratio 0.47ASTM E132
Shear Modulus 5.003 GPaASTM D732
Shear Strength 126 MPaASTM D732
Izod Impact Notched 82.0 JASTM D256
Izod Impact, Unnotched 863 J/mASTM D4812
Dart Drop, Total Energy 7.00 JASTM D3763
 
Electrical PropertiesOriginal ValueComments
Surface Resistance 100 - 1000 ohmASTM D257
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 1.8 MPa (264 psi) 335 °C
@Thickness 3.20 mm
unannealed; ASTM D648
 
Processing PropertiesOriginal ValueComments
Zone 2 380 - 400 °C
Zone 3 380 - 400 °C
Mold Temperature 175 - 190 °C
Drying Temperature 150 °CInjection Molding
Dry Time 4.00 - 6.00 hourInjection Molding
Back Pressure 0.300 - 0.700 MPa
Screw Speed 60 - 100 rpm

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PSABH81674 / 289621

Proto3000 – 3D Engineering Solutions

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