LNP THERMOCOMP DX11354X compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Improved Impact, Colorable. Features: Enhanced Ductility,Laser Direct Structuring,Circuit Solution,Colorable Information provided by SABIC |