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SABIC LNP™ THERMOTUF™ Compound WF006N Polybutylene Terephthalate (PBT)
Categories: Polymer; Thermoplastic; Polyester, TP; Polybutylene Terephthalate (PBT); Polybutylene Terephthalate (PBT), Unreinforced, Molded

Material Notes: LNP THERMOTUF WF006N compound is based on Polybutylene Terephthalate (PBT) resin containing 30% glass fiber. Added features of this grade include: High Metal Bonding Strength, High Impact, Good Dimensional Stability and Good Chemical Resistance. The potential applications include Nano-Molding Technology (NMT).

Features: High Stiffness,Chemical Resistance,Good metal adhesion,Nano molding technology grade,Good dimensional stability,High Impact Resistance,Structural

Information provided by SABIC

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Physical PropertiesOriginal ValueComments
Density 1.48 g/ccASTM D792
Moisture Absorption 0.0200 %Injection Molding
Viscosity 8.5 cP
@Load 5.00 kg,
Temperature 250 °C
MVR cc/10 min; ISO 1133
Linear Mold Shrinkage, Flow 0.0020 - 0.0030 cm/cmSABIC method
Linear Mold Shrinkage, Transverse 0.0040 - 0.0050 cm/cmSABIC method
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 110 MPa5 mm/min; ASTM D638
 120 MPa5 mm/min; ISO 527
Tensile Strength, Yield 110 MPa5 mm/min; ASTM D638
 120 MPa5 mm/min; ISO 527
Elongation at Break 2.5 %5 mm/min; ISO 527
 2.7 %5 mm/min; ASTM D638
Elongation at Yield 2.5 %5 mm/min; ISO 527
 2.7 %5 mm/min; ASTM D638
Tensile Modulus 7900 MPa5 mm/min; ASTM D638
 8200 MPa1 mm/min; ISO 527
Flexural Strength 156 MPabrk, 1.3 mm/min, 50 mm span; ASTM D790
 166 MPabreak, 2mm/min; ISO 178
Flexural Modulus 6600 MPa1.3 mm/min, 50 mm span; ASTM D790
 7400 MPa2 mm/min; ISO 178
Izod Impact Notched 165 JASTM D256
 124 J
@Temperature -30.0 °C
ASTM D256
Izod Impact, Unnotched 840 J/mASTM D4812
Izod Impact, Notched (ISO) 14.0 kJ/m²80*10*4; ISO 180/1A
 11.0 kJ/m²
@Temperature -30.0 °C
80*10*4; ISO 180/1A
Izod Impact, Unnotched (ISO) 52.0 kJ/m²80*10*4; ISO 180/1U
Charpy Impact Unnotched 62.0 kJ/m²ISO 179/2C
Charpy Impact, Notched 15.0 kJ/m²ISO 179/2C
 12.0 kJ/m²
@Temperature -30.0 °C
ISO 179/2C
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.05e+15 ohm-cmASTM D257
Dielectric Constant 3.53
@Frequency 1.10e+9 Hz
SABIC method
 3.54
@Frequency 1.90e+9 Hz
SABIC method
Dissipation Factor 0.011
@Frequency 1.90e+9 Hz
SABIC method
 0.012
@Frequency 1.10e+9 Hz
SABIC method
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 15.0 µm/m-°C
@Temperature 23.0 - 80.0 °C
ASTM E831
 16.0 µm/m-°C
@Temperature 23.0 - 80.0 °C
ISO 11359-2
 21.0 µm/m-°C
@Temperature -40.0 - 40.0 °C
ASTM E831
 22.0 µm/m-°C
@Temperature -40.0 - 40.0 °C
ISO 11359-2
CTE, linear, Transverse to Flow 45.0 µm/m-°C
@Temperature 23.0 - 80.0 °C
ASTM E831
 79.0 µm/m-°C
@Temperature -40.0 - 40.0 °C
ASTM E831
 82.0 µm/m-°C
@Temperature -40.0 - 40.0 °C
ISO 11359-2
 100 µm/m-°C
@Temperature 23.0 - 80.0 °C
ISO 11359-2
Deflection Temperature at 1.8 MPa (264 psi) 158 °CFlatw 80*10*4 sp=64mm; ISO 75/Af
 175 °C
@Thickness 6.40 mm
unannealed; ASTM D648
Vicat Softening Point 153 °CRate B/50; ASTM D1525
 157 °CRate B/50; ISO 306
UL RTI, Electrical 75.0 °CUL 746B
UL RTI, Mechanical with Impact 75.0 °CUL 746B
UL RTI, Mechanical without Impact 75.0 °CUL 746B
Flammability, UL94 HB
@Thickness >=0.700 mm
UL 94
 
Processing PropertiesOriginal ValueComments
Nozzle Temperature 245 - 275 °C
Zone 2 250 - 270 °C
Zone 3 250 - 270 °C
Melt Temperature 250 - 270 °CInjection Molding
Mold Temperature 100 - 160 °C
Drying Temperature 100 - 120 °CInjection Molding
Dry Time 2.00 - 4.00 hourInjection Molding
 8.00 hourCumulative; Injection Molding
Precipitation Temperature 40.0 - 60.0 °CHopper Temperature

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PSABH82040 / 289987

Ensinger SPI

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