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Chemically Resistant adhesives

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SABIC LNP™ KONDUIT™ Compound PX10323 Polyamide 6 (Nylon 6) (Europe)
Categories: Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 6 (PA6)

Material Notes: LNP KONDUIT PX10323 compound is based on Nylon 6 resin containing glass fiber. Added features of this grade include: Thermally Conductive.

Features: Thermally Conductive

Information provided by SABIC

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Physical PropertiesOriginal ValueComments
Density 1.61 g/ccASTM D792
 1.61 g/ccISO 1183
Linear Mold Shrinkage, Flow 0.0020 cm/cm24hrs; ASTM D955
Linear Mold Shrinkage, Transverse 0.0022 cm/cm24hrs; ASTM D955
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 70.0 MPa5 mm/min; ASTM D638
 73.0 MPa5 mm/min; ISO 527
Elongation at Break 0.80 %5 mm/min; ISO 527
 0.90 %5 mm/min; ASTM D638
Tensile Modulus 13700 MPa5 mm/min; ASTM D638
 14000 MPa1 mm/min; ISO 527
Flexural Strength 95.0 MPabrk, 1.3 mm/min, 50 mm span; ASTM D790
 96.0 MPabreak, 2mm/min; ISO 178
Flexural Modulus 14200 MPa1.3 mm/min, 50 mm span; ASTM D790
 14300 MPa2 mm/min; ISO 178
Izod Impact Notched 30.0 JASTM D256
Izod Impact, Unnotched 73.0 J/mASTM D4812
Izod Impact, Notched (ISO) 3.00 kJ/m²80*10*4; ISO 180/1A
Izod Impact, Unnotched (ISO) 6.00 kJ/m²80*10*4; ISO 180/1U
 
Electrical PropertiesOriginal ValueComments
Surface Resistance 1.05e+6 ohmASTM D257
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 14.0 µm/m-°C
@Temperature -30.0 - 80.0 °C
ISO 11359-2
 16.1 µm/m-°C
@Temperature -40.0 - 40.0 °C
ASTM E831
 16.2 µm/m-°C
@Temperature 23.0 - 80.0 °C
ISO 11359-2
CTE, linear, Transverse to Flow 35.6 µm/m-°C
@Temperature -40.0 - 40.0 °C
ASTM E831
 39.5 µm/m-°C
@Temperature -30.0 - 80.0 °C
ISO 11359-2
 47.7 µm/m-°C
@Temperature 23.0 - 80.0 °C
ISO 11359-2
Thermal Conductivity 1.50 W/m-Kthrough-plane, 60*60*3mm plaque; ISO 22007-2
 3.50 W/m-Kthrough-plane, 10*10*3mm sample; ASTM E1461-07
 15.0 W/m-Kin-plane, 25*0.4mm disc; ASTM E1461-07
 18.0 W/m-Kin-plane, 60*60*3mm plaque; ISO 22007-2
Hot Ball Pressure Test 165 °CPASS; IEC 60695-10-2
 205 °CIEC 60695-10-2
Deflection Temperature at 1.8 MPa (264 psi) 201 °CFlatw 80*10*4 sp=64mm; ISO 75/Af
 186 °C
@Thickness 3.20 mm
unannealed; ASTM D648
Flammability, UL94 HB
@Thickness >=0.750 mm
UL 94
Glow Wire Ignition Temperature 825 °C
@Thickness 1.00 mm
IEC 60695-2-13
 850 °C
@Thickness 1.50 mm
IEC 60695-2-13
 960 °C
@Thickness 3.00 mm
IEC 60695-2-13
Glow Wire Flammability Index 960 °C
@Thickness 1.00 mm
IEC 60695-2-12
 960 °C
@Thickness 1.50 mm
IEC 60695-2-12
 960 °C
@Thickness 3.00 mm
IEC 60695-2-12
 
Processing PropertiesOriginal ValueComments
Nozzle Temperature 270 - 300 °C
Zone 2 270 - 300 °C
Zone 3 270 - 300 °C
Melt Temperature 270 - 300 °CInjection Molding
Mold Temperature 80.0 - 100 °C
Drying Temperature 80.0 - 90.0 °CInjection Molding
Dry Time 3.00 - 4.00 hourInjection Molding
Back Pressure 3.00 - 9.00 MPa
Screw Speed 30 - 150 rpm

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PSABH80645 / 288592

Chemically Resistant adhesives

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