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Ensinger SPI

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Ensinger TECACOMP PEEK LDS black 1047045 Polyetheretherketone, Mineral Reinforced
Categories: Polymer; Thermoplastic; Polyketone; Polyetheretherketone (PEEK)

Material Notes:
  • developed for the LPKF-LDS® process
  • high adhesive strength
  • very good chemical resistance
  • inherent flame retardant
  • good heat deflection temperature
  • low moisture absorption
Target Industries:
  • electrical engineering
  • mechanical engineering
  • medical technology

Information provided by Ensinger Inc.

Vendors: Ensinger High Performance Plastics withstand severe environments, resist harsh chemicals, and perform well in extreme temperatures. They offer weight savings that have potential to drive lower cost systems.

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Physical PropertiesOriginal ValueComments
Density 1.67 g/cc
Water Absorption at Saturation <= 0.10 %50 % relative humidity up to saturation; DIN EN ISO 62
Linear Mold Shrinkage, Flow 0.0052 cm/cmDIN EN ISO 294-4
Linear Mold Shrinkage, Transverse 0.0056 cm/cmDIN EN ISO 294-4
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 102 MPaDIN EN ISO 527-1
Elongation at Break 2.3 %DIN EN ISO 527-1
Modulus of Elasticity 10.7 GPaDIN EN ISO 527-1
Charpy Impact Unnotched 31.0 kJ/m²DIN EN ISO 179-1eU
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+13 ohm-cmDIN EN 61340-2-3
Surface Resistance 1.00e+12 ohmDIN EN 61340-2-3
Dielectric Constant 3.6
@Frequency 1e+9 Hz
Dissipation Factor 0.0020
@Frequency 1e+9 Hz
Comparative Tracking Index 225 VDIN EN 60112
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 18.0 µm/m-°C
@Temperature 23.0 - 100 °C
DIN EN ISO 11359-1;2
 46.0 µm/m-°C
@Temperature 200 - 260 °C
DIN EN ISO 11359-1;2
 63.0 µm/m-°C
@Temperature 260 - 300 °C
DIN EN ISO 11359-1;2
CTE, linear, Transverse to Flow 26.0 µm/m-°C
@Temperature 23.0 - 100 °C
DIN EN ISO 11359-1;2
 67.0 µm/m-°C
@Temperature 200 - 260 °C
DIN EN ISO 11359-1;2
 88.0 µm/m-°C
@Temperature 260 - 300 °C
DIN EN ISO 11359-1;2
Thermal Conductivity 0.500 W/m-Kthrough-plane; ISO 22007-4:2008
 1.70 W/m-Kin-plane; ISO 22007-4:2008
Melting Point 343 °C
Maximum Service Temperature, Air 260 °Clong term
 300 °Cshort term
Deflection Temperature at 1.8 MPa (264 psi) 255 °CISO-R 75 Method A
Glass Transition Temp, Tg 143 °C
Flammability, UL94 V-0
@Thickness 0.800 mm
DIN IEC 60695-11-10
 
Processing PropertiesOriginal ValueComments
Processing Temperature 360 - 410 °C
Mold Temperature 170 - 210 °C
Drying Temperature 150 - 160 °C
Dry Time 2.00 - 4.00 hour
 
Descriptive Properties
Colorblack

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PENSIO9088 / 319016

Chemically Resistant adhesives

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