EOS Copper Cu DMSL on EOS M 290; 20 µm Layer Thickness

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EOS Copper Cu DMSL on EOS M 290; 20 µm Layer Thickness
Categories:	Metal; 3D Printing/Additive Manufacturing Metal; Nonferrous Metal; Copper Alloy; Titanium Alloy
Material Notes:	High purity copper for EOS M 290 platform to reach good electrical and thermal conductivity. Suitable for a wide variety of applications. Main Characteristics: High purity copper Good electrical and heat conductivity Process developed to achieve best possible conductivity using the EOS M 290 Typical Applications: Heat exchangers Electronics Variety of industry applications requiring good conductivityInformation provided by EOS GmbH (Electro Optical Systems).
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Physical Properties	Original Value	Comments

Porosity	<= 5.0 %
Thickness	20.0 microns

Mechanical Properties	Original Value	Comments
Tensile Strength	200 MPa	as manufactured
	150 MPa @Treatment Temp. 1000 °C, Time 3600 sec	heat treated in argon atmosphere, slow cooling with argon
Tensile Strength, Yield	180 MPa	as manufactured
	140 MPa @Treatment Temp. 1000 °C, Time 3600 sec	heat treated in argon atmosphere, slow cooling with argon
Elongation at Break	5.0 %	as manufactured
	20 % @Treatment Temp. 1000 °C, Time 3600 sec	heat treated in argon atmosphere, slow cooling with argon

Electrical Properties	Original Value	Comments
Volume Resistivity	<= 0.0000019 ohm-cm	heat treated, ASTM E1004-17; ASTM E1004-17
	<= 0.0000021 ohm-cm	as manufactured & heat treated, IACS (ASTM E1004-17); ASTM E1004-17

Component Elements Properties	Original Value	Comments
Copper, Cu	100 %	Nominal

Descriptive Properties
Volume rate	1.7 mm3/s

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NEOS926 / 280586

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