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Master Bond adhesives

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Plenco 3557 Phenolic, Granular, Compression Molded  (discontinued **)
Categories: Polymer; Thermoset; Filled/Reinforced Thermoset; Phenolic; Phenolic, Resole, Mineral Filled

Material Notes: PLENCO 03557 is a woodflour and mineral filled phenolic molding compound offering excellent dielectric strength values at elevated temperatures while maintaining mechanical strength properties. UL recognized under component file E40654. 03557 is available in black.

Information supplied by Plenco.

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Physical PropertiesOriginal ValueComments
Bulk Density 0.640 g/ccASTM D1895
Density 1.42 g/ccASTM D792
Water Absorption 0.53 %ASTM D570
Linear Mold Shrinkage 0.0053 cm/cmASTM D955
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell E 78ASTM D785
Tensile Strength, Ultimate 50.0 MPaASTM D638
Elongation at Break 0.66 %ASTM D638
Tensile Modulus 8.50 GPaASTM D638
Flexural Strength 85.0 MPaASTM D790
Flexural Modulus 7.70 GPaASTM D790
Compressive Strength 184 MPaASTM D695
Izod Impact, Notched 16.5 J/mASTM D256
Charpy Impact, Notched 0.187 J/cm²ASTM D256
Impact 111J/m Drop Ball Impact; PLENCO
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 2.40e+13 ohm-cmASTM D247
Dielectric Constant 5.1ASTM D150
Dielectric Strength 10.3 kV/mmStep by Step; ASTM D149
 13.6 kV/mmShort Time; ASTM D149
Dissipation Factor 0.042ASTM D150
Arc Resistance 141 secASTM D495
Comparative Tracking Index 175 VASTM D3638
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 194 °CHeat Resistance; ASTM D570D
Deflection Temperature at 1.8 MPa (264 psi) 176 °CASTM D648
Flammability, UL94 HB
@Thickness 1.50 mm
Oxygen Index 26.3 %ASTM D2863
Shrinkage 0.36 %72 hr, 120ºC; ASTM D1299

**
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