Epoxies, Etc 20-2121 Elastomeric Potting & Encapsulating Compound

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Epoxies, Etc 20-2121 Elastomeric Potting & Encapsulating Compound
Categories:	Polymer; Thermoset; Silicone
Material Notes:	Description: 20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect sensitive electronic components. It will impart very little stress on components during cure or thermal cycling. The base Natural Oil Polyol (NOP) used in 20-2121 is obtained directly from a plant source without chemical modifications. Due to the raw materials selected, this product is low in toxicity and considered a GREEN potting compound. Using renewable resources such as NOPs will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. Features: Low Toxicity Green Low Viscosity Low Durometer Moisture Resistant Convenient Mix Ratios Low Shrinkage & Exotherm Benefits: Reduce employee exposure to dangerous chemicals Reduce demand on non-renewable fossil fuels Quick self leveling around components Low stress on components & vibration resistant Can be used in wet environments Will not damage components during cure Information provided by Epoxies, Etc
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Physical Properties	Original Value	Comments

Specific Gravity	0.960 g/cc	Polyol Resin
	1.14 g/cc	Isocyanate
Viscosity	800 cP	Polyol Resin
	3200 cP	Mixed
	20000 cP	Isocyanate
Linear Mold Shrinkage	0.014 in/in
Storage Temperature	21.0 - 29.0 °C

Mechanical Properties	Original Value	Comments
Hardness, Shore A	65
Tensile Strength	2000 psi
Elongation at Break	155 %
Tear Strength	119 pli

Electrical Properties	Original Value	Comments
Volume Resistivity	7.20e+14 ohm-cm
Surface Resistance	>= 1.00e+15 ohm
Dielectric Constant	3.4 @Frequency 1000 Hz
Dielectric Strength	650 V/mil
Dissipation Factor	0.017 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	210 µm/m-°C
Thermal Conductivity	0.300 W/m-K
Maximum Service Temperature, Air	125 °C
Minimum Service Temperature, Air	-30.0 °C

Processing Properties	Original Value	Comments
Cure Time	1.50 hour @Temperature 65.0 °C
	2.50 hour @Temperature 45.0 °C
	24.0 hour @Temperature 25.0 °C
	40.0 min @Temperature 85.0 °C
Gel Time	20.0 min @Temperature 60.0 °C
	90.0 min @Temperature 25.0 °C

Descriptive Properties
Color	Clear/Amber
Mix Ratio	100:94	Iso:Polyol, by volume
	116:100	Iso:Polyol, by weight

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PFEPOX013 / 316690

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