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Metal adhesives

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Master Bond EP4EN-80 One component flowable epoxy for bonding and encapsulation
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced; Epoxy, Thermally Conductive

Material Notes: Master Bond EP4EN-80 is a one component, low viscosity epoxy mainly for potting applications. Curing is simple and straightforward, 90 minutes at 65°C plus 30 minutes at 80 to 85°C. It has a thermally conductive, electrically insulative filler material with ultra small particle sizes. This imparts high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing. EP4EN-80 is primarily for potting and encapsulation up to 1/4 inch thick. It is very low in viscosity and free flowing. Usually one part epoxies are too exothermic to be used in this fashion, but this system is specially formulated for lower heat generation. EP4EN-80 bonds well to a variety of substrates such as metals, composites, ceramics and many plastics. It is electrically isolating and transfers heat very effectively. Also noteworthy is its high modulus and compressive strength. EP4EN-80 can also be used as an adhesive. Because the particles are so small it can be applied in thicknesses ranging from 10-15 microns. The combination of thin bond lines and thermal conductivity lowers the thermal resistance to 10-20 x 10-6 K•m2/W. This is a big positive in managing heat related issues. EP4EN-80 will resist waters, oils and fuels. Its color is gray. The service temperature range is -50°C to +150°C. The fact that this one part system with curing temperatures not exceeding 85°C, along with the other desirable properties mentioned above, offers an attractive option for small encapsulation applications in microelectronics.

Product Advantages:

  • Single component; no mixing needed
  • Unlimited working life at room temperature
  • Easy to manage curing schedule
  • Highly useful potting epoxy
  • Low thermal resistant adhesive
  • Passes NASA low outgassing specifications
Key Features:
  • Thermally conductive, electrically insulating
  • Ultra fine particle size
  • Can cure up to 1/4 inch thick
  • High modulus and compressive strength

Information provided by Master Bond.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.49 g/cc
Solids Content 100 %
Viscosity 600 - 1800 cP
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 85 - 95
Tensile Strength 5000 - 7000 psi
Elongation at Break 1.0 - 3.0 %
Tensile Modulus 1.20e+6 - 1.40e+6 psi
Compressive Strength 24000 - 26000 psi
Adhesive Bond Strength 1300 - 1500 psiTensile lap shear, Al to Al
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+14 ohm-cm
Dielectric Constant 4.4
@Frequency 60 Hz
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 5.20 - 5.90 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C
Minimum Service Temperature, Air -50.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 1.50 hour
@Temperature 65.0 °C
1.5 hours at 65°F plus 30 minutes at 80-85°C
Shelf Life 2.00 - 4.00 Month
@Temperature -15.6 - -12.2 °C

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PMASTM630 / 268818

Metal adhesives

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