SABIC LNP™ THERMOCOMP™ Compound WF006XXB Polybutylene Terephthalate (PBT)

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SABIC LNP™ THERMOCOMP™ Compound WF006XXB Polybutylene Terephthalate (PBT)
Categories:	Polymer; Thermoplastic; Polyester, TP; Polybutylene Terephthalate (PBT); Polybutylene Terephthalate (PBT), Unreinforced, Molded
Material Notes:	LNP THERMOCOMP WF006XXB compound is based on Polybutylene Terephthalate (PBT) resin containing 30% glass fiber. Added features of this grade include: Medium Flow, Healthcare, Low Extractables, Biocompatible (ISO10993 or USP Class VI). Features: Low Extractable,Healthcare,High Stiffness,Food Contact Acceptable,Biocompatible,Structural Information provided by SABIC
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Physical Properties	Original Value	Comments

Specific Gravity	1.51 g/cc	ASTM D792
	1.53 g/cc	ASTM D792
Density	1.53 g/cc	ISO 1183
Water Absorption	0.060 % @Time 86400 sec	ASTM D570
Moisture Absorption	0.0200 %	Injection Molding
	0.0600 %	23°C / 50% RH; ISO 62
Water Absorption at Saturation	0.26 %	ISO 62-1
Viscosity	13 cP @Load 2.16 kg, Temperature 250 °C	MVR cc/10 min; ISO 1133
Linear Mold Shrinkage, Flow	0.0030 - 0.0050 cm/cm @Thickness 1.50 - 3.20 mm	SABIC method
	0.0030 - 0.0080 cm/cm @Thickness 3.20 mm	SABIC method
	0.0050 - 0.0080 cm/cm @Thickness 3.20 - 4.60 mm	SABIC method
Linear Mold Shrinkage, Transverse	0.0040 - 0.0060 cm/cm @Thickness 1.50 - 3.20 mm	SABIC method
	0.0060 - 0.0090 cm/cm @Thickness 3.20 - 4.60 mm	SABIC method
Melt Flow	17 g/10 min @Load 2.16 kg, Temperature 250 °C	ASTM D1238

Mechanical Properties	Original Value	Comments
Hardness, Rockwell R	118	ASTM D785
Tensile Strength at Break	120 MPa	5 mm/min; ASTM D638
	125 MPa	5 mm/min; ISO 527
Tensile Strength, Yield	120 MPa	5 mm/min; ASTM D638
	125 MPa	5 mm/min; ISO 527
Elongation at Break	2.0 %	5 mm/min; ISO 527
	3.0 %	5 mm/min; ASTM D638
Elongation at Yield	2.0 %	5 mm/min; ISO 527
	3.0 %	5 mm/min; ASTM D638
Tensile Modulus	9300 MPa	5 mm/min; ASTM D638
	9300 MPa	1 mm/min; ISO 527
Flexural Strength	189 MPa	brk, 1.3 mm/min, 50 mm span; ASTM D790
	195 MPa	yield, 2 mm/min; ISO 178
Flexural Modulus	7580 MPa	1.3 mm/min, 50 mm span; ASTM D790
	8500 MPa	2 mm/min; ISO 178
Izod Impact Notched	85.0 J	ASTM D256
	80.0 J @Temperature -30.0 °C	ASTM D256
Izod Impact, Unnotched	801 J/m	ASTM D4812
Izod Impact, Notched (ISO)	8.00 kJ/m²	80104; ISO 180/1A
	7.00 kJ/m² @Temperature -30.0 °C	80104; ISO 180/1A
Izod Impact, Unnotched (ISO)	45.0 kJ/m²	80104; ISO 180/1U
	45.0 kJ/m² @Temperature -30.0 °C	80104; ISO 180/1U
Charpy Impact, Notched	5.00 kJ/m²	Edgew 80104 sp=62mm; ISO 179/1eA
Dart Drop, Total Energy	10.0 J	ASTM D3763

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 3.20e+16 ohm-cm	ASTM D257
Dielectric Constant	3.7 @Frequency 1e+6 Hz	ASTM D150
	3.8 @Frequency 100 Hz	ASTM D150
Dielectric Strength	18.7 kV/mm @Thickness 3.20 mm	in air; ASTM D149
	24.8 kV/mm @Thickness 1.60 mm	in oil; ASTM D149
Dissipation Factor	0.0020 @Frequency 100 Hz	ASTM D150
	0.020 @Frequency 1e+6 Hz	ASTM D150

Thermal Properties	Original Value	Comments
CTE, linear, Parallel to Flow	25.2 µm/m-°C @Temperature -40.0 - 40.0 °C	ASTM E831
	25.2 µm/m-°C @Temperature 60.0 - 138 °C	ASTM E831
	25.2 µm/m-°C @Temperature -40.0 - 40.0 °C	ISO 11359-2
CTE, linear, Transverse to Flow	120 µm/m-°C @Temperature -40.0 - 40.0 °C	ISO 11359-2
Deflection Temperature at 0.46 MPa (66 psi)	215 °C @Thickness 6.40 mm	unannealed; ASTM D648
Deflection Temperature at 1.8 MPa (264 psi)	200 °C	Flatw 80104 sp=64mm; ISO 75/Af
	207 °C @Thickness 6.40 mm	unannealed; ASTM D648
Vicat Softening Point	215 °C	Rate B/50; ASTM D1525
	215 °C	Rate B/50; ISO 306
	220 °C	Rate B/120; ISO 306

Processing Properties	Original Value	Comments
Nozzle Temperature	245 - 260 °C
Zone 2	245 - 260 °C
Zone 3	250 - 265 °C
Melt Temperature	250 - 265 °C	Injection Molding
Mold Temperature	65.0 - 90.0 °C
Drying Temperature	120 °C	Injection Molding
Dry Time	3.00 - 4.00 hour	Injection Molding
	12.0 hour	Cumulative; Injection Molding
Back Pressure	0.300 - 0.700 MPa
Shot Size	40 - 80 %
Vent Depth	0.00250 - 0.00380 cm
Screw Speed	50 - 80 rpm

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PSABH81957 / 289904

USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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