Tosoh OP-3 Semiconductor high-purity grade, Fused Silica Glass

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Tosoh OP-3 Semiconductor high-purity grade, Fused Silica Glass
Categories:	Ceramic; Glass
Material Notes:	Tosoh OP-1 and OP-3 materials are manufactured by fusing a high-purity silica powder using Tosoh's proprietary oxy-hydrogen flame fusion process and a method of generating uniformly dispersed small bubbles inside the material. Thanks to its high purity and excellent infrared blocking properties, OP-1 has become the material of choice as a heat-insulating material for semiconductor and solar manufacturing equipment, such as epi and RTP chambers, and oxidation, diffusion, and CVD batch furnaces. OP-3 is an enhanced version of OP-1 material, with further reduced alkali content for use in processes that require extreme contamination control. OP-3HD is a high-density version of OP-3, with a smaller diameter bubble size distribution that provides enhanced sealing properties and lifetime for advanced batch furnace processes. Available in up to 1,000mm round and square ingots, OP-1, OP-3, and OP-3HD materials are 450mm wafer ready. Information provided by Tosh Corporation
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Physical Properties	Original Value	Comments

Density	2.02 g/cc
Viscosity	12600 cP @Temperature 1200 °C

Mechanical Properties	Original Value	Comments
Hardness, Vickers	907.5
Flexural Strength	42.0 - 67.0 MPa

Electrical Properties	Original Value	Comments
Dielectric Constant	3.7 @Frequency 5.00e+8 Hz
Dielectric Strength	25.5 kV/mm @Frequency 50 Hz
Dielectric Loss Index	<= 1.0 @Frequency 5.00e+8 Hz

Thermal Properties	Original Value	Comments
CTE, linear	0.640 µm/m-°C @Temperature 30.0 - 600 °C
Specific Heat Capacity	0.749 J/g-°C
Thermal Conductivity	1.24 W/m-K
Softening Point	1720 °C	(?=107.6)*2
Annealing Point	1170 °C	(?=1013)
Strain Point	1070 °C	(?=1014.5)

Descriptive Properties
Chemical Properties	? 0.01ppm	Cu
	0.05 ppm	Mg
	0.06 ppm	K
	0.13 ppm	Li
	0.15 ppm	Na
	0.21 ppm	Fe
	0.7 ppm	Ca
	160 ppm	OH
	8.3 ppm	Al

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PTOSOH014 / 306469

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