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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® 930-1 Thermally Conductive, Electrically Insulating Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Material Description: A two part, thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, optics or medical devices. It is a lower viscosity and smaller particle size alternative to EPO-TEK® 930.

Information Provided by Epoxy Technology

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.03 g/ccPart B
 1.40 g/ccPart A
Particle Size <= 20 µm
Viscosity 60000 - 80000 cP
@Temperature 23.0 °C
5 rpm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 82
Tensile Modulus 793000 psiStorage
Shear Strength 1636 psiLap
 >= 3400 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+13 ohm-cm
Dielectric Constant 3.99
@Frequency 1000 Hz
Dissipation Factor 0.0040
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 28.0 µm/m-°CBelow Tg
 96.0 µm/m-°CAbove Tg
Thermal Conductivity 1.07 W/m-K
Maximum Service Temperature, Air 200 °CContinuous
 300 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 70.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 412 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 6.00 hour
@Temperature 80.0 °C
minimum
 10.0 min
@Temperature 150 °C
minimum
Pot Life 1440 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorAmberPart B
 WhitePart A
ConsistencySmooth paste
Mix Ratio by Weight100:4
Number of ComponentsTwo
Thixotropic Index3.8
Weight Loss0.09%200°C
 0.5%250°C
 1.31%300°C

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PPOXYT058 / 141097

Chemically Resistant adhesives

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