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Ensinger SPI

Ensinger TECACOMP PEEK LDS grey 1061958 Polyetheretherketone, Mineral Reinforced
Categories: Polymer; Thermoplastic; Polyketone; Polyetheretherketone (PEEK)

Material Notes:
  • developed for the LPKF-LDS® process
  • high adhesive strength
  • very good chemical resistance
  • inherent flame retardant
  • good heat deflection temperature
  • low moisture absorption
Target Industries:
  • electrical engineering
  • mechanical engineering
  • medical technology
  • automotive industry

Information provided by Ensinger Inc.

Vendors: Ensinger High Performance Plastics withstand severe environments, resist harsh chemicals, and perform well in extreme temperatures. They offer weight savings that have potential to drive lower cost systems.

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Physical PropertiesMetricEnglishComments
Density 1.65 g/cc0.0596 lb/in³
Water Absorption at Saturation 0.040 %0.040 %50 % relative humidity up to saturation; DIN EN ISO 62
Linear Mold Shrinkage, Flow 0.0060 cm/cm0.0060 in/inDIN EN ISO 294-4
Linear Mold Shrinkage, Transverse 0.0060 cm/cm0.0060 in/inDIN EN ISO 294-4
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 103 MPa14900 psiDIN EN ISO 527-1
Elongation at Break 2.2 %2.2 %DIN EN ISO 527-1
Modulus of Elasticity 10.7 GPa1550 ksiDIN EN ISO 527-1
Charpy Impact Unnotched 3.00 J/cm²14.3 ft-lb/in²DIN EN ISO 179-1eU
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+16 ohm-cm1.00e+16 ohm-cmDIN EN 61340-2-3
Surface Resistance 1.00e+14 ohm1.00e+14 ohmDIN EN 61340-2-3
Dielectric Constant 3.6
@Frequency 1e+9 Hz
3.6
@Frequency 1e+9 Hz
Dissipation Factor 0.00060
@Frequency 1e+9 Hz
0.00060
@Frequency 1e+9 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow  18.0 µm/m-°C
@Temperature 23.0 - 100 °C
10.0 µin/in-°F
@Temperature 73.4 - 212 °F
DIN EN ISO 11359-1;2
 47.0 µm/m-°C
@Temperature 200 - 260 °C
26.1 µin/in-°F
@Temperature 392 - 500 °F
DIN EN ISO 11359-1;2
 63.0 µm/m-°C
@Temperature 260 - 300 °C
35.0 µin/in-°F
@Temperature 500 - 572 °F
DIN EN ISO 11359-1;2
CTE, linear, Transverse to Flow  31.0 µm/m-°C
@Temperature 23.0 - 100 °C
17.2 µin/in-°F
@Temperature 73.4 - 212 °F
DIN EN ISO 11359-1;2
 87.0 µm/m-°C
@Temperature 200 - 260 °C
48.3 µin/in-°F
@Temperature 392 - 500 °F
DIN EN ISO 11359-1;2
 110 µm/m-°C
@Temperature 260 - 300 °C
61.1 µin/in-°F
@Temperature 500 - 572 °F
DIN EN ISO 11359-1;2
Thermal Conductivity 0.500 W/m-K3.47 BTU-in/hr-ft²-°Fthrough-plane; ISO 22007-4:2008
 1.20 W/m-K8.33 BTU-in/hr-ft²-°Fin-plane; ISO 22007-4:2008
Melting Point 343 °C649 °F
Maximum Service Temperature, Air 260 °C500 °Flong term
 300 °C572 °Fshort term
Deflection Temperature at 1.8 MPa (264 psi) 254 °C489 °FISO-R 75 Method A
Glass Transition Temp, Tg 143 °C289 °F
Flammability, UL94 V-0
@Thickness 0.900 mm
V-0
@Thickness 0.0354 in
DIN IEC 60695-11-10
 
Processing PropertiesMetricEnglishComments
Processing Temperature 360 - 410 °C680 - 770 °F
Mold Temperature 170 - 210 °C338 - 410 °F
Drying Temperature 160 °C320 °F
Dry Time 4.00 hour4.00 hour
 
Descriptive Properties
Colorgrey

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PENSIO9089 / 319017

Chemically Resistant adhesives

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