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Metal adhesives

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Master Bond EP21QF Two component, room temperature curing epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Key Features:
  • Forgiving 1:1 mix ratio by weight or volume
  • Moderate viscosity and good flow
  • Reliable electrical insulator
  • Thermally conductive
Product Description: Master Bond EP21QF is a two component epoxy adhesive, sealant, coating, and encapsulating system combining outstanding physical properties, along with exceptionally easy processing. It cures at room temperature or more quickly at elevated temperatures. A 22 gram mass will cure in 1 hour at 65°C. A summary of additional curing schedule options is presented in the chart below. EP21QF is notable for its superb dimensional stability and low shrinkage upon curing. EP21QF bonds well to a wide variety of substrates including metals, composites, glass, ceramics and many rubbers and plastics. It withstands rigorous thermal cycling, as well as vibration and shock. This epoxy resists water, oils, fuels and many salts. The service temperature range is from -80°F to +300°F. The system is color coded, with Part A being black, and Part B white, and upon mixing, the color becomes gray. Most importantly, EP21QF conducts heat while retaining electrical insulation. It is a versatile system with potential usage in electronic, electrical, aerospace, and specialty OEM type applications.

Product Advantages:

  • Forgiving 1:1 mix ratio by weight or volume
  • Excellent flow properties
  • Robust physical strength profile
  • Low shrinkage and good dimensional stability
  • Good heat conduction
  • Superior dielectric properties

Information provided by Master Bond.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.33 g/ccPart B
 1.34 g/ccMixed
 1.47 g/ccPart A
Viscosity 10000 - 20000 cPPart A
 20000 - 30000 cPMixed
 25000 - 35000 cPPart B
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 75 - 85
Tensile Strength 6000 - 7000 psi
Tensile Modulus 450000 - 500000 psi
Adhesive Bond Strength 1800 - 2000 psiTensile lap shear, Al to Al
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+14 ohm-cm
Dielectric Constant 3.4
@Frequency 60 Hz
Dielectric Strength >= 450 V/mil
@Thickness 3.17 mm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 30.0 - 35.0 µm/m-°C
Thermal Conductivity 5.50 - 6.00 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 300 °F
Minimum Service Temperature, Air -80.0 °F
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 hour22 grams
 2.00 - 3.00 hour
@Temperature 71.1 °C
Option 2
 48.0 - 72.0 hour
@Temperature 23.9 °C
Option 1
Working Life 90.0 - 120 minafter mixing, 100 gram batch
Shelf Life 1.00 Monthin original, unopened containers
 
Descriptive Properties
Mixing ratio1:1 by weightPart A to B

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PMASTM5913 / 306802

Metal adhesives

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