Henkel Loctite® ABLESTIK 5025E Epoxy Film

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Henkel Loctite® ABLESTIK 5025E Epoxy Film
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Silver Product Benefits: Thin, uniform bondline control Provides RF/EMI shielding Electrically conductive in x, y, z axes Excellent electrical and thermal conductivity Passes NASA outgassing Cure: Heat cure Application: Die attach Typical Package Application: Microwave circuitry and Heat sink attach LOCTITE ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	0.500 %	Saturation, after 85% RH exposure
pH	6.0
Thickness	4.00 mil	Adhesive Film Thickness

Mechanical Properties	Original Value	Comments
Tensile Modulus	28.0 MPa @Temperature 250 °C	Cured, DMTA
	49.0 MPa @Temperature 150 °C	Cured, DMTA
	3700 MPa @Temperature 25.0 °C	Cured, DMTA
	5400 MPa @Temperature -65.0 °C	Cured, DMTA
Shear Strength	13.0 MPa	Lap, Al to Al

Electrical Properties	Original Value	Comments
Volume Resistivity	<= 0.00050 ohm-cm

Thermal Properties	Original Value	Comments
CTE, linear	65.0 µm/m-°C	Cured, Below Tg
	150 µm/m-°C	Cured, Above Tg
Thermal Conductivity	6.50 W/m-K @Temperature 121 °C	Cured
Glass Transition Temp, Tg	90.0 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	30.0 min @Temperature 150 °C
	120 min @Temperature 125 °C	Alternative Cure Schedule
Shelf Life	3.00 Month	Work Life, Uncured
	6.00 Month @Temperature 5.00 °C	Uncured, from date of manufacture

Descriptive Properties
Bond Joint Resistance	0.002 ohms/0.5 sq inch
Extractable Ionic Content (ppm)	<30	Cured, Sodium (Na+)
	<5	Cured, Potassium (K+)
	<50	Cured, Chloride (Cl-)
Shear Strength	13 kg-f	Die, 2 x 2 mm Si die on Ag/Cu LF
Water Extract Conductivity	15 µmhos/cm	Cured
Weight Loss (%)	0.15	Cure, 10 x 10 mm Si die on glass slide

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PLOCT5020 / 255231

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