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Ensinger SPI

SABIC LNP™ THERMOTUF™ Compound WF006NiQ Polybutylene Terephthalate (PBT)
Categories: Polymer; Thermoplastic; Polyester, TP; Polybutylene Terephthalate (PBT); Polybutylene Terephthalate (PBT), Unreinforced, Molded

Material Notes: LNP THERMOTUF WF006NiQ compound is based on Polybutylene Terephthalate (PBT) resin utilizing ELCRIN iQ upcycling technology and containing 30% glass fiber. Added features of this grade include: Impact Modified, High Flow, Good Metal Bonding Strength and Good Chemical Resistance suitable for Nano-Molding Technology (NMT) applications, >25% Post Consumer Recycled content.

Features: Post-Consumer Recycled (PCR) content,Impact Modified,High Stiffness,Chemical Resistance,Good metal adhesion,Nano molding technology grade,High Flow,Structural

Information provided by SABIC

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Physical PropertiesMetricEnglishComments
Density 1.49 g/cc0.0538 lb/in³ISO 1183
Moisture Absorption 0.0200 %0.0200 %Injection Molding
Viscosity  15 cP
@Load 5.00 kg,
Temperature 250 °C
15 cP
@Load 11.0 lb,
Temperature 482 °F
MVR cc/10 min; ISO 1133
 23 cP
@Load 5.00 kg,
Temperature 270 °C
23 cP
@Load 11.0 lb,
Temperature 518 °F
MVR cc/10 min; ISO 1133
 29 cP
@Load 5.00 kg,
Temperature 275 °C
29 cP
@Load 11.0 lb,
Temperature 527 °F
MVR cc/10 min; ISO 1133
Linear Mold Shrinkage, Flow 0.0020 - 0.0030 cm/cm0.0020 - 0.0030 in/inSABIC method
Linear Mold Shrinkage, Transverse 0.0040 - 0.0050 cm/cm0.0040 - 0.0050 in/inSABIC method
Melt Flow  21 g/10 min
@Load 5.00 kg,
Temperature 250 °C
21 g/10 min
@Load 11.0 lb,
Temperature 482 °F
ASTM D1238
 37 g/10 min
@Load 5.00 kg,
Temperature 275 °C
37 g/10 min
@Load 11.0 lb,
Temperature 527 °F
ASTM D1238
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 110 MPa16000 psi5 mm/min; ASTM D638
 111 MPa16100 psi5 mm/min; ISO 527
Elongation at Break 2.5 %2.5 %5 mm/min; ASTM D638
 2.5 %2.5 %5 mm/min; ISO 527
Tensile Modulus 8.60 GPa1250 ksi1 mm/min; ISO 527
 8.76 GPa1270 ksi5 mm/min; ASTM D638
Flexural Strength 168 MPa24400 psibreak, 2mm/min; ISO 178
 170 MPa24700 psibrk, 1.3 mm/min, 50 mm span; ASTM D790
Flexural Modulus 7.10 GPa1030 ksi2 mm/min; ISO 178
 7.70 GPa1120 ksi1.3 mm/min, 50 mm span; ASTM D790
Adhesive Bond Strength 33.0 MPa4790 psi("T" treatment, shear type); ISO 19095
Izod Impact Notched 137 J101 ft-lbASTM D256
 100 J
@Temperature -30.0 °C
73.8 ft-lb
@Temperature -22.0 °F
ASTM D256
Izod Impact, Unnotched 8.70 J/cm16.3 ft-lb/inASTM D4812
Izod Impact, Notched (ISO) 13.0 kJ/m²6.19 ft-lb/in²80*10*4; ISO 180/1A
 10.0 kJ/m²
@Temperature -30.0 °C
4.76 ft-lb/in²
@Temperature -22.0 °F
80*10*4; ISO 180/1A
Izod Impact, Unnotched (ISO) 54.0 kJ/m²25.7 ft-lb/in²80*10*4; ISO 180/1U
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant  3.53
@Frequency 1e+10 Hz
3.53
@Frequency 1e+10 Hz
SABIC method
 3.59
@Frequency 5.00e+9 Hz
3.59
@Frequency 5.00e+9 Hz
SABIC method
 3.61
@Frequency 1.10e+9 Hz
3.61
@Frequency 1.10e+9 Hz
SABIC method
 3.62
@Frequency 1.90e+9 Hz
3.62
@Frequency 1.90e+9 Hz
SABIC method
Dissipation Factor  0.0090
@Frequency 1e+10 Hz
0.0090
@Frequency 1e+10 Hz
SABIC method
 0.010
@Frequency 5.00e+9 Hz
0.010
@Frequency 5.00e+9 Hz
SABIC method
 0.012
@Frequency 1.90e+9 Hz
0.012
@Frequency 1.90e+9 Hz
SABIC method
 0.013
@Frequency 1.10e+9 Hz
0.013
@Frequency 1.10e+9 Hz
SABIC method
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow  23.0 µm/m-°C
@Temperature 23.0 - 50.0 °C
12.8 µin/in-°F
@Temperature 73.4 - 122 °F
ISO 11359-2
 23.0 µm/m-°C
@Temperature -40.0 - 40.0 °C
12.8 µin/in-°F
@Temperature -40.0 - 104 °F
ISO 11359-2
 24.0 µm/m-°C
@Temperature 23.0 - 50.0 °C
13.3 µin/in-°F
@Temperature 73.4 - 122 °F
ASTM E831
 24.0 µm/m-°C
@Temperature -40.0 - 40.0 °C
13.3 µin/in-°F
@Temperature -40.0 - 104 °F
ASTM E831
CTE, linear, Transverse to Flow  81.0 µm/m-°C
@Temperature -40.0 - 40.0 °C
45.0 µin/in-°F
@Temperature -40.0 - 104 °F
ASTM E831
 86.0 µm/m-°C
@Temperature -40.0 - 40.0 °C
47.8 µin/in-°F
@Temperature -40.0 - 104 °F
ISO 11359-2
 90.0 µm/m-°C
@Temperature 23.0 - 50.0 °C
50.0 µin/in-°F
@Temperature 73.4 - 122 °F
ASTM E831
 96.0 µm/m-°C
@Temperature 23.0 - 50.0 °C
53.3 µin/in-°F
@Temperature 73.4 - 122 °F
ISO 11359-2
Deflection Temperature at 0.46 MPa (66 psi) 200 °C392 °FFlatw 80*10*4 sp=64mm; ISO 75/Bf
 204 °C
@Thickness 3.20 mm
399 °F
@Thickness 0.126 in
unannealed; ASTM D648
Deflection Temperature at 1.8 MPa (264 psi) 156 °C313 °FFlatw 80*10*4 sp=64mm; ISO 75/Af
 162 °C
@Thickness 3.20 mm
324 °F
@Thickness 0.126 in
unannealed; ASTM D648
UL RTI, Electrical 75.0 °C167 °FUL 746B
UL RTI, Mechanical with Impact 75.0 °C167 °FUL 746B
UL RTI, Mechanical without Impact 75.0 °C167 °FUL 746B
Flammability, UL94 HB
@Thickness >=0.700 mm
HB
@Thickness >=0.0276 in
UL 94
 
Processing PropertiesMetricEnglishComments
Nozzle Temperature 245 - 275 °C473 - 527 °F
Zone 2 250 - 270 °C482 - 518 °F
Zone 3 250 - 270 °C482 - 518 °F
Melt Temperature 250 - 270 °C482 - 518 °FInjection Molding
Mold Temperature 100 - 160 °C212 - 320 °F
Drying Temperature 100 - 120 °C212 - 248 °FInjection Molding
Dry Time 2.00 - 4.00 hour2.00 - 4.00 hourInjection Molding
 8.00 hour8.00 hourCumulative; Injection Molding
Precipitation Temperature 40.0 - 60.0 °C104 - 140 °FHopper Temperature

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PSABH82041 / 289988

Ensinger SPI

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