LNP THERMOCOMP DF004XXAR1 compound is based on Polycarbonate (PC) resin containing 20% glass fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Excellent Ductility and Smooth Surface Finish. Features: High Heat Resistance,High Impact Resistance Information provided by SABIC |