Goodfellow High Thermal Conductivity Silicon Nitride

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Goodfellow High Thermal Conductivity Silicon Nitride
Categories:	Ceramic; Nitride
Material Notes:	High Thermal Conductivity - much higher than typical silicon nitride. High fracture toughness. Surface roughness of Ra 0.02 µm achievable through polishing. Used in Power module substrates; Various types of heat sinks; LED mounting substrates; High frequency circuit substrates. Information provided by Goodfellow.
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Physical Properties	Original Value	Comments

Density	3.30 g/cc

Mechanical Properties	Original Value	Comments
Tensile Modulus	312 GPa
Flexural Strength	700 MPa
Poissons Ratio	0.29
Shear Modulus	121 GPa

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+13 ohm-cm

Thermal Properties	Original Value	Comments
CTE, linear	3.00 µm/m-°C @Temperature 25.0 - 800 °C
Thermal Conductivity	100 W/m-K

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CGOODF248m / 197462

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