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Chemically Resistant adhesives

SABIC LNP™ KONDUIT™ Compound DTK22 Polycarbonate (PC)
Categories: Polymer; Thermoplastic; Polycarbonate (PC)

Material Notes: LNP KONDUIT DTK22 compound is based on Polycarbonate (PC) resin containing minerals. Added features of this grade include: Thermally Conductive and Electrically Insulative.

Features: Electrically Isolative,Thermally Conductive

Information provided by SABIC

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.46 g/cc0.0527 lb/in³ASTM D792
Moisture Absorption 0.0200 %0.0200 %Injection Molding
 0.0300 %0.0300 %23°C / 50% RH; ISO 62
Linear Mold Shrinkage, Flow 0.0041 cm/cm0.0041 in/in24hrs; ASTM D955
Linear Mold Shrinkage, Transverse 0.0039 cm/cm0.0039 in/in24hrs; ASTM D955
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 41.0 MPa5950 psi5 mm/min; ASTM D638
 42.0 MPa6090 psi5 mm/min; ISO 527
Elongation at Break 4.1 %4.1 %5 mm/min; ISO 527
 5.0 %5.0 %5 mm/min; ASTM D638
Tensile Modulus 3.83 GPa555 ksi5 mm/min; ASTM D638
 3.88 GPa563 ksi1 mm/min; ISO 527
Flexural Strength 77.0 MPa11200 psibrk, 1.3 mm/min, 50 mm span; ASTM D790
 79.0 MPa11500 psiyld, 1.3 mm/min, 50 mm span; ASTM D790
 81.0 MPa11700 psibreak, 2mm/min; ISO 178
Flexural Modulus 3.16 GPa458 ksi1.3 mm/min, 50 mm span; ASTM D790
 4.18 GPa606 ksi2 mm/min; ISO 178
Izod Impact Notched 150 J111 ft-lbASTM D256
Izod Impact, Unnotched 7.00 J/cm13.1 ft-lb/inASTM D4812
Izod Impact, Notched (ISO) 13.0 kJ/m²6.19 ft-lb/in²80*10*4; ISO 180/1A
Izod Impact, Unnotched (ISO) 41.0 kJ/m²19.5 ft-lb/in²80*10*4; ISO 180/1U
Charpy Impact Unnotched 1.30 - 4.80 J/cm²6.19 - 22.8 ft-lb/in²ISO R179
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 3.66
@Frequency 1.10e+9 Hz
3.66
@Frequency 1.10e+9 Hz
ASTM ES 7-83
Dissipation Factor 0.0094
@Frequency 1.10e+9 Hz
0.0094
@Frequency 1.10e+9 Hz
ASTM ES 7-83
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 53.0 µm/m-°C
@Temperature 40.0 - 120 °C
29.4 µin/in-°F
@Temperature 104 - 248 °F
ASTM E831
CTE, linear, Transverse to Flow 85.0 µm/m-°C
@Temperature 40.0 - 120 °C
47.2 µin/in-°F
@Temperature 104 - 248 °F
ASTM E831
Thermal Conductivity 0.300 W/m-K2.08 BTU-in/hr-ft²-°Fthrough-plane, 60*60*3mm plaque; ISO 22007-2
 0.600 W/m-K4.16 BTU-in/hr-ft²-°Fthrough-plane, 10*10*3mm sample; ASTM E1461-07
 1.30 W/m-K9.02 BTU-in/hr-ft²-°Fin-plane, 60*60*3mm plaque; ISO 22007-2
 2.00 W/m-K13.9 BTU-in/hr-ft²-°Fin-plane, 25*0.4mm disc; ASTM E1461-07
Deflection Temperature at 0.46 MPa (66 psi) 128 °C262 °FFlatw 80*10*4 sp=64mm; ISO 75/Bf
 127 °C
@Thickness 3.20 mm
261 °F
@Thickness 0.126 in
ASTM D648
Deflection Temperature at 1.8 MPa (264 psi) 119 °C246 °FFlatw 80*10*4 sp=64mm; ISO 75/Af
 121 °C
@Thickness 3.20 mm
250 °F
@Thickness 0.126 in
ASTM D648
UL RTI, Electrical 80.0 °C176 °FUL 746B
UL RTI, Mechanical with Impact 80.0 °C176 °FUL 746B
UL RTI, Mechanical without Impact 80.0 °C176 °FUL 746B
Flammability, UL94 HB
@Thickness >=0.500 mm
HB
@Thickness >=0.0197 in
UL 94
Glow Wire Ignition Temperature  850 °C
@Thickness 0.800 mm
1560 °F
@Thickness 0.0315 in
IEC 60695-2-13
 850 °C
@Thickness 1.00 mm
1560 °F
@Thickness 0.0394 in
IEC 60695-2-13
Glow Wire Flammability Index  850 °C
@Thickness 0.800 mm
1560 °F
@Thickness 0.0315 in
IEC 60695-2-12
 875 °C
@Thickness 1.00 mm
1610 °F
@Thickness 0.0394 in
IEC 60695-2-12
 
Processing PropertiesMetricEnglishComments
Nozzle Temperature 260 - 290 °C500 - 554 °F
Zone 2 260 - 290 °C500 - 554 °F
Zone 3 260 - 290 °C500 - 554 °F
Melt Temperature 260 - 300 °C500 - 572 °FInjection Molding
Mold Temperature 80.0 - 120 °C176 - 248 °F
Drying Temperature 120 °C248 °FInjection Molding
Dry Time 2.00 - 4.00 hour2.00 - 4.00 hourInjection Molding
Precipitation Temperature 60.0 - 80.0 °C140 - 176 °FHopper Temperature

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PSABH80638 / 288585

Chemically Resistant adhesives

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