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Chemically Resistant adhesives

Sumitomo Bakelite North America 2008A Glass Reinforced Hardware Grade Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Molded, Glass Fiber Filler; Filled/Reinforced Thermoset

Material Notes: Epoxy is the premier material for military firewall connectors.

Information provided by Sumitomo Bakelite North America, Inc.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.85 g/cc0.0668 lb/in³ASTM D792
Water Absorption 0.20 %0.20 %48 hours, 50°C. ASTM D570
Linear Mold Shrinkage 0.0030 - 0.0050 cm/cm0.0030 - 0.0050 in/inCompression Molding. ASTM D955
 
Mechanical PropertiesMetricEnglishComments
Hardness, Barcol 7272
Tensile Strength, Ultimate 62.0 MPa8990 psiASTM D638
Flexural Yield Strength 124 MPa18000 psiASTM D790
Flexural Modulus 15.2 GPa2200 ksiASTM D790
Compressive Yield Strength 207 MPa30000 psiASTM D695
Izod Impact, Notched 0.350 J/cm0.656 ft-lb/inASTM D256A
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 4.04.0Wet; ASTM D150
Dielectric Strength 12.0 kV/mm305 kV/inWet, short term. ASTM D149
Dissipation Factor 0.019
@Frequency 1e+6 Hz
0.019
@Frequency 1e+6 Hz
Wet; ASTM D150
Arc Resistance 180 sec180 secASTM D495
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 37.0 µm/m-°C
@Temperature 20.0 °C
20.6 µin/in-°F
@Temperature 68.0 °F
ASTM D696
Thermal Conductivity 0.691 W/m-K4.80 BTU-in/hr-ft²-°FASTM F433
Deflection Temperature at 1.8 MPa (264 psi) 260 °C500 °FASTM D648A
Oxygen Index 50 %50 %ASTM D2863
 
Processing PropertiesMetricEnglishComments
Mold Temperature 143 - 177 °C289 - 351 °Fcompression/transfer molding.
 174 - 182 °C345 - 360 °Finjection molding.

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PROG64 / 66275

Chemically Resistant adhesives

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