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Chemically Resistant adhesives

Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive
Material Notes: Product Description: EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. Also available in a single component frozen syringe. This is an increased thermal conductivity version of EPOTEK® H20E.

Advantages & Application Notes:

  • Processing info - it can be applied by many dispensing, stamping and screen printing techniques.
    • Dispensing: compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a singlecomponent fashion.
    • Screen Printing: best using >200 metal mesh with polymer squeegee blade with 80D hardness.
    • Stamping: small dots 6 mil in diameter can be realized.
  • Misc /Other notes:
    • Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hot plate, IR, convection, or inductor coil.
  • Suggested applications:
    • LED – HB LED industry; light engines for HD-TV; LCD color projection.
    • Solar, die-attach epoxy for CPV chips onto ceramic carriers; thermal epoxy for ceramic to aL finned heat sink.

    Information Provided by Epoxy Technology
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 3.44 g/cc3.44 g/ccPart A
 4.39 g/cc4.39 g/ccPart B
Particle Size <= 45 µm<= 45 µm
Viscosity 3500 - 6000 cP
@Temperature 23.0 °C		3500 - 6000 cP
@Temperature 73.4 °F		50 rpm
 
Chemical PropertiesMetricEnglishComments
Ionic Impurities - Na (Sodium) 24 ppm24 ppm
Ionic Impurities - K (Potassium) >= 17 ppm>= 17 ppm
Ionic Impurities - Cl (Chloride) 34 ppm34 ppm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 9393
Tensile Modulus 3.9490 GPa572.75 ksiStorage
Shear Strength 11.7 MPa1700 psiLap
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.000080 ohm-cm<= 0.000080 ohm-cm
 
Thermal PropertiesMetricEnglishComments
CTE, linear 53.0 µm/m-°C29.4 µin/in-°FBelow Tg
 80.0 µm/m-°C44.4 µin/in-°FAbove Tg
Thermal Conductivity  10.9 W/m-K
@Temperature 150 °C,
Time 3600 sec		75.6 BTU-in/hr-ft²-°F
@Temperature 302 °F,
Time 1.00 hour
 23.0 W/m-K
@Temperature 150 °C,
Time 3600 sec		160 BTU-in/hr-ft²-°F
@Temperature 302 °F,
Time 1.00 hour		+ 200°C/1Hr
Maximum Service Temperature, Air 175 °C347 °FContinuous
 275 °C527 °FIntermittent
Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
 -55.0 °C-67.0 °FIntermittent
Decomposition Temperature 372 °C702 °FDegradation Temperature
 
Processing PropertiesMetricEnglishComments
Cure Time 30.0 min
@Temperature 175 °C		0.500 hour
@Temperature 347 °F		Minimum Bond Line
Pot Life 3600 min3600 min
Shelf Life 12.0 Month
@Temperature 25.0 °C		12.0 Month
@Temperature 77.0 °F
 
Descriptive Properties
ColorSilverPart A
 SilverPart B
ConsistencySmooth thixotropic paste
Ionic Impurities NH445 ppm
Mix Ratio by Weight1:1
Number of ComponentsTwo
Thixotropic Index3.48
Weight Loss0.14%200°C
 0.42%250°C
 1.05%300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PPOXYT031 / 141070

Chemically Resistant adhesives




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