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Meldin Supplier

DuPont Mobility and Materials Vespel® SCP-5009 Polyimide
Categories: Polymer; Thermoplastic; Polyimide, Thermoplastic

Material Notes: Bearing Material

Information provided by DuPont. This product line has remained with DuPont after the DuPont-Dow merger.

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Physical PropertiesMetricEnglishComments
Specific Gravity 1.50 g/cc1.50 g/ccASTM D792
Water Absorption 0.090 %0.090 %ASTM D570
Deformation 0.030 %0.030 %ASTM D621
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell E 9191ASTM D785
Tensile Strength  57.0 MPa
@Temperature 260 °C
8270 psi
@Temperature 500 °F
D-1780 Specimen
 116 MPa
@Temperature 22.8 °C
16800 psi
@Temperature 73.0 °F
ASTM D638
Elongation at Break  3.0 %
@Temperature 22.8 °C
3.0 %
@Temperature 73.0 °F
ASTM D638
 9.7 %
@Temperature 260 °C
9.7 %
@Temperature 500 °F
D-1780 Specimen
Modulus of Elasticity  2.612 GPa
@Temperature 260 °C
378.8 ksi
@Temperature 500 °F
D 1780 Specimen
 6.003 GPa
@Temperature 22.8 °C
870.7 ksi
@Temperature 73.0 °F
ASTM D638
Flexural Strength  99.0 MPa
@Temperature 260 °C
14400 psi
@Temperature 500 °F
ASTM D790
 195 MPa
@Temperature 22.8 °C
28300 psi
@Temperature 73.0 °F
ASTM D790
Flexural Modulus  3.56 GPa
@Temperature 260 °C
516 ksi
@Temperature 500 °F
ASTM D790
 6.231 GPa
@Temperature 22.8 °C
903.7 ksi
@Temperature 73.0 °F
ASTM D790
Compressive Strength  414 MPa
@Temperature 260 °C
60000 psi
@Temperature 500 °F
ASTM D695
 481 MPa
@Temperature 22.8 °C
69800 psi
@Temperature 73.0 °F
ASTM D695
 96.0 MPa
@Strain 10 %,
Temperature 260 °C
13900 psi
@Strain 10 %,
Temperature 500 °F
ASTM D695
 222 MPa
@Strain 10 %,
Temperature 22.8 °C
32200 psi
@Strain 10 %,
Temperature 73.0 °F
ASTM D695
Compressive Modulus  1.663 GPa
@Temperature 260 °C
241.2 ksi
@Temperature 500 °F
ASTM D695
 2.594 GPa
@Temperature 22.8 °C
376.2 ksi
@Temperature 73.0 °F
ASTM D695
 
Thermal PropertiesMetricEnglishComments
CTE, linear 44.0 µm/m-°C
@Temperature 23.0 - 300 °C
24.4 µin/in-°F
@Temperature 73.4 - 572 °F
ASTM E831

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