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• ConocoPhillips Syncon® EP Heavy Duty Grease NLGI 1
• ConocoPhillips Syncon® EP Heavy Duty Grease NLGI 2
• ConocoPhillips Syncon® Extra Long Life Grease NLGI No. 00
• ConocoPhillips Syncon® HP Synthetic Grease NLGI No. 1
• ConocoPhillips Synterra™ 1 Hydraulic Oil, AGMA No. 1
• ConocoPhillips Synterra™ 2 Hydraulic Oil, AGMA No. 2
• ConocoPhillips Synterra™ 3 Hydraulic Oil, AGMA No.3
• ConocoPhillips Synterra™ 32 Hydraulic Oil 32
• ConocoPhillips Synterra™ 32 Wire Rope Lubricant 32
• ConocoPhillips SynXPA® 100 R&O Oil
• ConocoPhillips SynXPA® 150 R&O Oil
• ConocoPhillips SynXPA® 32 R&O Oil
• ConocoPhillips SynXPA® 32 Turbine Oil
• ConocoPhillips SynXPA® 68 R&O Oil
• ConocoPhillips SynXPA® H-500 H Lubricant H-500
• ConocoPhillips SynXPA® HC-150 H Lubricant HC-150
• ConocoPhillips SynXPA® HC-450 H Lubricant HC-450
• ConocoPhillips Tacna® 2000 NLGI No. 1
• ConocoPhillips Tacna® 2000 NLGI No. 2
• ConocoPhillips Tacna® EP Polyurea Grease NLGI Grade 1
• ConocoPhillips Tacna® EP Polyurea Grease NLGI Grade 2
• ConocoPhillips Tacna® HD Grease NLGI Grade 1
• ConocoPhillips Tacna® HD Grease NLGI Grade 2
• ConocoPhillips Tacna® M5 Grease NLGI Grade 0
• ConocoPhillips Tacna® M5 Grease NLGI Grade 1
• ConocoPhillips Tacna® M5 Grease NLGI Grade 2
• ConocoPhillips Tacna® Rx NLGI No. 1
• ConocoPhillips Tacna® Rx NLGI No. 2
• ConocoPhillips Transformer Oil
• ConocoPhillips Trolley Wire Lube
• Constantan Thermocouple Wire
• Contact Metal, UNS C83300, Copper Casting Alloy
• Cookson Group Plaskon® 1002 Conventional Encapsulant
• Cookson Group Plaskon® 1031 Conventional Encapsulant
• Cookson Group Plaskon® 150.401 Encapsulation Resin
• Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound
• Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound
• Cookson Group Plaskon® 3100LS Mineral Filled Conventional Encapsulant
• Cookson Group Plaskon® 3200LS Mineral Filled Novolac Epoxy Molding Compound
• Cookson Group Plaskon® 3300S Mineral Filled Novolac Epoxy Molding Compound
• Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound
• Cookson Group Plaskon® 3300SH Mineral Filled Epoxy Molding Compound
• Cookson Group Plaskon® 3400 Epoxy Molding Compound
• Cookson Group Plaskon® 3400-2 Conventional Encapsulant
• Cookson Group Plaskon® 3400F Epoxy Molding Compound
• Cookson Group Plaskon® 3400F-14 Conventional Encapsulant
• Cookson Group Plaskon® 3400FP Epoxy Molding Compound
• Cookson Group Plaskon® 435 Mineral Filled Epoxy Molding Compound
• Cookson Group Plaskon® 440 Mineral Filled Novolac Epoxy Molding Compound
• Cookson Group Plaskon® 440S Mineral Filled Novolac Epoxy Molding Compound
• Cookson Group Plaskon® 7060 Conventional Encapsulant
• Cookson Group Plaskon® 7090 Conventional Encapsulant
• Cookson Group Plaskon® 7115 Conventional Encapsulant
• Cookson Group Plaskon® ALP-2 (188.pcs03) Thin Package Encapsulant
• Cookson Group Plaskon® ALP-2 (197.sh03) Thin Package Encapsulant
• Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound
• Cookson Group Plaskon® AMC-2RA Low Stress Epoxy Molding Compound
• Cookson Group Plaskon® AMC-2RC Low Stress Epoxy Molding Compound
• Cookson Group Plaskon® CMU-870-2A Molded Underfill Compound for Flip Chip BGAs and CSPs
• Cookson Group Plaskon® CMU-870-2B Molded Underfill Compound for Flip Chip BGAs and CSPs
• Cookson Group Plaskon® CMU-870-2C Molded Underfill Compound for Flip Chip BGAs and CSPs
• Cookson Group Plaskon® CMU-880-MA Molded Underfill Compound for Flip Chip BGAs and CSPs
• Cookson Group Plaskon® LS-16 Low Stress Epoxy Molding Compound
• Cookson Group Plaskon® LS-16S Molding Compound
• Cookson Group Plaskon® MUF-2A LAR Molded Underfill Compound for Flip Chip BGAs and CSPs
• Cookson Group Plaskon® MUF-2A Molded Underfill Compound for Flip Chip BGAs and CSPs
• Cookson Group Plaskon® MUF-2B Molded Underfill Compound for Flip Chip BGAs and CSPs
• Cookson Group Plaskon® MUF-2C Molded Underfill Compound for Flip Chip BGAs and CSPs
• Cookson Group Plaskon® MUF-LFG Molded Underfill Compound for Flip Chip BGAs and CSPs, Lead-Free Green
• Cookson Group Plaskon® NXG-1 Next Generation Molding Compound for PBGAs
• Cookson Group Plaskon® NXG-1FP Next Generation Molding Compound for Fine Pitch Applications
• Cookson Group Plaskon® NXG-1HS Next Generation Molding Compound for Heat Spreader Applications
• Cookson Group Plaskon® NXG-1LAR Low Alpha Next Generation Molding Compound for PBGAs
• Cookson Group Plaskon® PPF-165 Conventional Epoxy Molding Compound
• Cookson Group Plaskon® PPF-165A Molding Compound
• Cookson Group Plaskon® S-7 Low Stress Epoxy Encapsulant
• Cookson Group Plaskon® S-7LA Molding Compound
• Cookson Group Plaskon® S-7P Epoxy Encapsulant
• Cookson Group Plaskon® S-7PG Low Stress Epoxy Encapsulant
• Cookson Group Plaskon® S-7S Epoxy Encapsulant
• Cookson Group Plaskon® SE3001 Silver Filled Epoxy
• Cookson Group Plaskon® SMT-B-1 LAS (146.408) Epoxy Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B1 Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B-1F Epoxy Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B-1FX (146.801) Epoxy Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B-1FX Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B-1LAR Low Alpha, Fast Curing Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B-1LAS Low Alpha Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B-1LV Epoxy Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B-1LV Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B-1N Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B-1NLV Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B-1RC (146.403) Epoxy Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B-1RC Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B-1™ Epoxy Molding Compound for PBGAs
• Cookson Group Plaskon® SMT-B-2 Molding Compound for PBGA and CSP
• Cookson Group Plaskon® SMT-B-2FP Molding Compound for PBGA and CSP
• Cookson Group Plaskon® SMT-B-2FPI Molding Compound for PBGA and CSP
• Cookson Group Plaskon® SMT-B-2HS Molding Compound for Heat Spreader Applications
• Cookson Group Plaskon® ULS-12 Epoxy Encapsulant
• Cookson Group Plaskon® ULS-12HLG Epoxy Encapsulant
• Cookson Group Plaskon® ULS-12LA Molding Compound
• Cookson Group POLYSOLDER® LS One Part Electrically Conductive Adhesive Paste
• Cookson Group POLYSOLDER® LT One Part Electrically Conductive Adhesive Paste
• Cookson Group POLYSOLDER® LT Two Part Electrically Conductive Adhesive Paste
• Cookson Group POLYSOLDER® LTD One Part Electrically Conductive Adhesive Paste
• Cookson Group STAYCHIP® 2078E No-Flow Fluxing Underfill
• Cookson Group STAYCHIP® 3080 High Reliability Flip Chip Underfill, Fast Flow and Cure
• Cookson Group STAYCHIP® 3082 High Reliability Flip Chip Underfill, Low CTE
• Cookson Group STAYCHIP® 3083 Low Stress Underfill with Enhanced JEDEC Performance
• Cookson Group STAYCHIP® 3090.mk.01 High Productivity Capillary Underfill
• Cookson Group STAYCHIP® 3100 High Reliability Flip Chip Underfill
• Cookson Group STAYCHIP® 3103 Low Stress Underfill with Enhanced JEDEC Performance
• Cookson Group STAYCHIP® 3105 Low Stress Underfill for Large Die Flip Chip
• Cookson Group STAYDRY® GA2000-2 Particle and Moisture Getter
• Cookson Group STAYDRY® H2-3000 Hydrogen and Moisture Getter
• Cookson Group STAYDRY® HiCap2000 High Capacity Moisture Getter
• Cookson Group STAYDRY® SD1000 High Temperature Moisture Getter
• Cookson Group STAYDRY® SD800 Low Temperature Moisture Getter
• Cookson Group STAYSTIK® 101G Silver Filled Electrically Conductive Paste
• Cookson Group STAYSTIK® 171 Silver Filled Electrically Conductive Paste
• Cookson Group STAYSTIK® 181 Silver Filled Electrically Conductive Paste
• Cookson Group STAYSTIK® 181G Silver Filled Electrically Conductive Paste
• Cookson Group STAYSTIK® 211G Aluminum Nitride Filled Thermally Enhanced Paste
• Cookson Group STAYSTIK® 272 Aluminum Nitride Filled Thermally Enhanced Paste
• Cookson Group STAYSTIK® 282 Aluminum Nitride Filled Thermally Enhanced Paste
• Cookson Group STAYSTIK® 282G Aluminum Nitride Filled Thermally Enhanced Paste
• Cookson Group STAYSTIK® 301G Non-Filed Dielectric Interposer Paste
• Cookson Group STAYSTIK® 336T Patented Technology
• Cookson Group STAYSTIK® 371 Non-Filed Dielectric Interposer Paste
• Cookson Group STAYSTIK® 383 Non-Filed Dielectric Interposer Paste
• Cookson Group STAYSTIK® 383G Non-Filed Dielectric Interposer Paste
• Cookson Group STAYSTIK® 415 Non-Filed Dielectric Interposer Film
• Cookson Group STAYSTIK® 472 Non-Filed Dielectric Interposer Film
• Cookson Group STAYSTIK® 482 Non-Filed Dielectric Interposer Film
• Cookson Group STAYSTIK® 492 Non-Filed Dielectric Interposer Film
• Cookson Group STAYSTIK® 501 Silver Filled Electrically Conductive Film
• Cookson Group STAYSTIK® 571 Silver Filled Electrically Conductive Film
• Cookson Group STAYSTIK® 581 Silver Filled Electrically Conductive Film
• Cookson Group STAYSTIK® 591 Silver Filled Electrically Conductive Film
• Cookson Group STAYSTIK® 611 Aluminum Nitride Filled Thermally Enhanced Film
• Cookson Group STAYSTIK® 672 Aluminum Nitride Filled Thermally Enhanced Film
• Cookson Group STAYSTIK® 682 Aluminum Nitride Filled Thermally Enhanced Film
• Cookson Group STAYSTIK® 692 Aluminum Nitride Filled Thermally Enhanced Film
• Cookson Group STAYSTIK® 701G Alumina Filled "Low Flow" Dielectric Paste
• Cookson Group STAYSTIK® 773 Alumina Filled "Low Flow" Dielectric Paste
• Cookson Group STAYSTIK® 783 Alumina Filled "Low Flow" Dielectric Paste
• Cookson Group STAYSTIK® 783G Alumina Filled "Low Flow" Dielectric Paste
• Cookson Group STAYSTIK® 811 Alumina Filled "Low Flow" Dielectric Film
• Cookson Group STAYSTIK® 872 Alumina Filled "Low Flow" Dielectric Film
• Cookson Group STAYSTIK® 882 Alumina Filled "Low Flow" Dielectric Film
• Cookson Group STAYSTIK® 892 Alumina Filled "Low Flow" Dielectric Film
• Cookson Group STAYSTIK® Resin E Patented Technology Paste
• Cool Polymers Coolpoly® D1202 Thermally Conductive Polypropylene
• Cool Polymers Coolpoly® D3606 Thermally Conductive Polyamide 4,6
• Cool Polymers Coolpoly® D3608 Thermally Conductive High Temperature Polyamide (HTN)
• Cool Polymers Coolpoly® D3612 Thermally Conductive Polyamide (PA66/6)
• Cool Polymers Coolpoly® D4302 Thermally Conductive Polybutylene Terephthalate
• Cool Polymers Coolpoly® D5108 Thermally Conductive Polyphenylene Sulfide
• Cool Polymers Coolpoly® D5110 Thermally Conductive Polyphenylene Sulfide
• Cool Polymers Coolpoly® D5112 Thermally Conductive Polyphenylene Sulfide
• Cool Polymers Coolpoly® D5502 Thermally Conductive Liquid Crystalline Polymer
• Cool Polymers Coolpoly® D5506 Thermally Conductive Liquid Crystalline Polymer
• Cool Polymers Coolpoly® D8102 Thermally Conductive Thermoplastic Elastomer
• Cool Polymers Coolpoly® E1201 Thermally Conductive Polypropylene
• Cool Polymers Coolpoly® E2 Thermally Conductive Liquid Crystalline Polymer
• Cool Polymers Coolpoly® E3603 Thermally Conductive Polyphthalamide (PPA)
• Cool Polymers Coolpoly® E3607 Thermally Conductive Polyamide (PA6)
• Cool Polymers Coolpoly® E4301 Thermally Conductive Polybutylene Terephthalate
• Cool Polymers Coolpoly® E4501 Thermally Conductive Polycarbonate
• Cool Polymers Coolpoly® E5101 Thermally Conductive Polyphenylene Sulfide
• Cool Polymers Coolpoly® E5103 Thermally Conductive Polyphenylene Sulfide
• Cool Polymers Coolpoly® E5105 Thermally Conductive Polyphenylene Sulfide
• Cool Polymers Coolpoly® E8101 Thermally Conductive Thermoplastic Elastomer
• CoorsTek ACI-Co10 Tungsten Carbide
• CoorsTek ACI-Co6 Tungsten Carbide
• CoorsTek ACI-Ni10 Tungsten Carbide
• CoorsTek ACI-Ni6 Tungsten Carbide
• CoorsTek AD-85 Alumina (nom. 85% Al₂O₃)
• CoorsTek AD-90 Alumina (nom. 90% Al₂O₃)
• CoorsTek AD-94 Alumina (nom. 94% Al₂O₃)
• CoorsTek AD-96 Alumina (nom. 96% Al₂O₃)
• CoorsTek AD-995 Alumina (nom. 99.5% Al₂O₃)
• CoorsTek AD-996 99.6% Alumina
• CoorsTek AD-998 Alumina(nom. 99.8% Al₂O₃)
• CoorsTek ADD-96 96% Alumina
• CoorsTek ADOS-90R 91% Alumina Thick Film Substrate
• CoorsTek ADS-96R 96% Alumina Thick Film Substrate
• CoorsTek ADS-995 99.5% Alumina Thin Film
• CoorsTek ADS-995R MidFilm™ 99.5% Alumina Thick Film
• CoorsTek ADS-996 99.6% Alumina Thin Film
• CoorsTek ADSR-96R DuraStrate™ 96% Alumina Thick Film
• CoorsTek AIN-170 Hot Pressed Aluminum Nitride
• CoorsTek Alumina-Zirconia Composite, AZ-25
• CoorsTek Boron Carbide Reaction-Bonded Boron Carbide
• CoorsTek CAP 3 99.5% Alumina Ceramic Armor Material
• CoorsTek CAP 4 98.5% Alumina Ceramic Armor Material
• CoorsTek CRB-100 Resin-Impregnated Carbon Graphite
• CoorsTek CRB-200 Resin-Impregnated Carbon Graphite
• CoorsTek CRB-300 General-Duty Carbon Graphite
• CoorsTek CRB-400 Antimony-Impregnated Carbon Graphite
• CoorsTek CRB-500 Medium Strength Carbon Graphite
• CoorsTek CRB-600 Resin-Bonded Carbon Graphite
• CoorsTek Direct Sintered Silicon Carbide, SC DS (SC-30, UltraSiC™)
• CoorsTek DuraSense™ Ceramic Alumina Toughened Zirconia
• CoorsTek Dura-Z™ MgO Partially Stabilized Zirconia
• CoorsTek Epoxy Seal 216 (ES-216) B-staged epoxy lids
• CoorsTek Epoxy Seal 923 (ES-923) B-staged epoxy lids
• CoorsTek FG-98 98% Alumina Ceramic Armor Material
• CoorsTek FG-995 Alumina (nom. 98.5% Al₂O₃)
• CoorsTek Hot Pressed Aluminum Nitride
• CoorsTek Mullite, S2
• CoorsTek Nitrogen Bonded Silicon Carbide, SCNB
• CoorsTek PlasmaPure™ Alumina (nom. 99.8% Al₂O₃)
• CoorsTek PlasmaPure-UC™ 99.9% Alumina
• CoorsTek PolyGlyde™ 1000 Self-Lubricating Seal
• CoorsTek PolyGlyde™ 2000 Self-Lubricating Seal
• CoorsTek PolyGlyde™ 3000 Self-Lubricating Seal
• CoorsTek PolyGlyde™ 5400 Self-Lubricating Seal
• CoorsTek Porcelain
• CoorsTek Pure SiC™ HR CVD Silicon Carbide, > 99.9995%
• CoorsTek Pure SiC™ LR CVD Silicon Carbide, > 99.9995%
• CoorsTek Reaction Bonded Silicon Carbide, SCRB (SC-2)
• CoorsTek SC-BNL (SC-42) Loaded Reaction Bonded Silicon Carbide
• CoorsTek SC-DSG (SC-35) Graphite Loaded Sintered Silicon Carbide
• CoorsTek SC-DSLP (SC-50) Liquid Phase Sintered Silicon Carbide
• CoorsTek StatSafe™ ADC Static Dissipative Alumina
• CoorsTek StatSafe™ ZDC Static Dissipative Zirconia
• CoorsTek StatSafe™ ZDC-W Static Dissipative Zirconia
• CoorsTek Superstrate® 996 99.6% Alumina Thin Film
• CoorsTek Superstrate® TPS 99.6% Alumina Thin Film
• CoorsTek TTZ (Dura-Z™) MgO Partially Stabilized Zirconia
• CoorsTek Tungsten Carbide, WC
• CoorsTek Yttria Partially Stabilized Zirconia, YZTP, Sintered
• CoorsTek YZTP Yttria Partially Stabilized Zirconia, Hipped
• CoorsTek ZDY Yttria Fully Stabilized Zirconia
• CoorsTek Zirconia-Toughened Alumina, ZTA
• CoorsTek Z-PLUS™ 94 Zirconia-Impr. Alumina Ceramic Armor Material
• Copper (I) Acetate, CuC₂H₃O₂
• Copper (I) Acetylide, Cu₂C₂
• Copper (I) Azide, CuN₃
• Copper (I) Bromide, CuBr
• Copper (I) Chloride, CuCl
• Copper (I) Cyanide, CuCN
• Copper (I) Fluoride, CuF
• Copper (I) Hydride, CuH
• Copper (I) Iodide, CuI
• Copper (I) Mercury Iodide, Cu₂HgI₄
• Copper (I) Oxide, Cu₂O (Cuprite)
• Copper (I) Selenide, Cu₂Se