MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Ensinger SPI

Ensinger TECASINT™ 2031 Polyimide, 40% Graphite Filled (PI)
Categories: Polymer; Thermoplastic; Polyimide, Thermoplastic; Thermoplastic Polyimide, Graphite Filled

Material Notes: TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications. TECASINT™ 2011 is very pure, and exhibits low outgassing. It is also characterized by it’s long term thermal stability, outstanding wear resistance, high creep resistance, and strength up to its continuous use temperature of 536° F. TECASINT™ 2021 contains 15% graphite and is also available for applications requiring improved wear resistance & lower coefficient of friction.
  • Superior high temperature characteristics (TECASINT™ 2000 series can operate up to 536° F continuously)
  • Excellent long-term thermal stability
  • Outstanding bearing and wear properties (at elevated temperatures, TECASINT™ 2000 formulations offer superior wear rates)
  • Excellent creep resistance
  • High strength and stiffness properties
  • High purity characteristics (only extremely low levels of extractables and ionic impurities are apparent in TECASINT™ 2011)
  • Good chemical resistance (TECASINT™ 2000 series is not attacked by common solvents or fuels and is acceptable for use in contact with many acids)

TECASINT™ 2000 series with their superior physical properties, are ideal for applications in the aerospace, nuclear, automotive, electrical/electronics, and chemical processing industries. TECASINT™ shapes are excellent candidates for high purity applications in the semiconductor processing industry. Typical components produced from TECASINT™ applications include seals, thrust washers, bushings and wear pads in transportation/off-highway equipment, insulating and support elements in electrical welding and brazing equipment, and wafer-handling components in the harsh environment of semiconductor plasma ovens. Pump and valve seals, vanes, and piston rings are also commonly produced from TECASINT™ series materials.

Information Provided by Ensinger Inc.

Vendors: Ensinger High Performance Plastics withstand severe environments, resist harsh chemicals, and perform well in extreme temperatures. They offer weight savings that have potential to drive lower cost systems.

Click here to view all available suppliers for this material.

Please click here if you are a supplier and would like information on how to add your listing to this material.

 
Physical PropertiesMetricEnglishComments
Density 1.59 g/cc
@Temperature 23.0 °C
0.0574 lb/in³
@Temperature 73.4 °F
DIN 53 479
Filler Content 40 %40 %Graphite
Water Absorption  1.2 %
@Temperature 23.0 °C,
Time 86400 sec
1.2 %
@Temperature 73.4 °F,
Time 24.0 hour
EN ISO 62
 2.18 %
@Temperature 80.0 °C,
Time 86400 sec
2.18 %
@Temperature 176 °F,
Time 24.0 hour
EN ISO 62
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 84
@Temperature 23.0 °C
84
@Temperature 73.4 °F
DIN 53 505
Tensile Strength, Yield 65.0 MPa
@Temperature 23.0 °C
9430 psi
@Temperature 73.4 °F
EN ISO 527
Elongation at Break 2.1 %
@Temperature 23.0 °C
2.1 %
@Temperature 73.4 °F
EN ISO 527
Tensile Modulus 6.30 GPa
@Temperature 23.0 °C
914 ksi
@Temperature 73.4 °F
EN ISO 527
Flexural Strength 87.5 MPa
@Temperature 23.0 °C
12700 psi
@Temperature 73.4 °F
EN ISO 178
Flexural Modulus 5.207 GPa
@Temperature 23.0 °C
755.2 ksi
@Temperature 73.4 °F
EN ISO 178
Flexural Strain at Yield 2.2 %2.2 %EN ISO 178
Compressive Yield Strength 124 MPa18000 psi10% Strain; EN ISO 604
Compressive Strength 131 MPa
@Temperature 23.0 °C
19000 psi
@Temperature 73.4 °F
EN ISO 604
Compressive Modulus 2.027 GPa
@Temperature 23.0 °C
294.0 ksi
@Temperature 73.4 °F
EN ISO 604
Charpy Impact Unnotched 1.42 J/cm²6.76 ft-lb/in²EN ISO 179
Charpy Impact, Notched 0.330 J/cm²
@Temperature 23.0 °C
1.57 ft-lb/in²
@Temperature 73.4 °F
EN ISO 179
Compression Set 12.5 %12.5 %Compression at Break; EN ISO 604
 
Thermal PropertiesMetricEnglishComments
CTE, linear  30.0 µm/m-°C
@Temperature 50.0 - 200 °C
16.7 µin/in-°F
@Temperature 122 - 392 °F
DIN 53 752
 38.0 µm/m-°C
@Temperature 200 - 300 °C
21.1 µin/in-°F
@Temperature 392 - 572 °F
DIN 53 752
Maximum Service Temperature, Air 300 °C572 °F
Glass Transition Temp, Tg 370 °C698 °FDMTA
Flammability, UL94 V-0V-0
 
Descriptive Properties
ColorBlack
DIN-AbbreviationPI CS 40

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Ensinger TECASINT 3022 Polyimide, Black, 15% Graphite (PI)
Ensinger TECASINT 3012 Polyimide, Ochre Brown (PI)
Ensinger TECASINT 1611 Polyimide, 30% PTFE Filled (PI)
Ensinger TECASINT 1101 Polyimide (PI)
Ensinger TECASINT 1061 Polyimide, 15% Graphite, 10% PTFE Filled (PI)

PENSIN053 / 98114

Proto3000 – 3D Engineering Solutions

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.