Envalior ForTii® LDS85B PPA-GF30 PA4T High Temperature Polyamide

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Envalior ForTii® LDS85B PPA-GF30 PA4T High Temperature Polyamide
Categories:	Polymer; Thermoplastic; Polyphthalamide (PPA); Polyphthalamide (PPA), 30% Glass Fiber Reinforced
Material Notes:	ForTii® is a high temperature polyamide for applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries. ForTii® LDS85B enables mechanical function integration with high impact resistance and ductility. LDS85B has very good plating performance. Features: Laser Direct Structuring. 30% glass reinforced. Processing: Injection Molding. Former DSM Engineering Plastics product line is now with Envalior.
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Physical Properties	Metric	English	Comments

Density	1.51 g/cc	0.0546 lb/in³	Dry; ISO 1183
Moisture Absorption	1.40 %	1.40 %	Dry; Sim. to ISO 62
Linear Mold Shrinkage, Flow	0.0033 cm/cm	0.0033 in/in	Dry; ISO 294-4
Linear Mold Shrinkage, Transverse	0.013 cm/cm	0.013 in/in	Dry; ISO 294-4

Mechanical Properties	Metric	English	Comments
Tensile Strength at Break	45.0 MPa @Temperature 160 °C	6530 psi @Temperature 320 °F	ISO 527-1/-2
	64.0 MPa @Temperature 120 °C	9280 psi @Temperature 248 °F	Dry; ISO 527-1/-2
	105 MPa @Temperature 23.0 °C	15200 psi @Temperature 73.4 °F	Cond; ISO 527-1/-2
	125 MPa @Temperature 23.0 °C	18100 psi @Temperature 73.4 °F	Dry; ISO 527-1/-2
Elongation at Break	2.1 % @Temperature 23.0 °C	2.1 % @Temperature 73.4 °F	Dry; ISO 527-1/-2
	2.1 % @Temperature 23.0 °C	2.1 % @Temperature 73.4 °F	Cond; ISO 527-1/-2
	4.0 % @Temperature 120 °C	4.0 % @Temperature 248 °F	Dry; ISO 527-1/-2
	6.0 % @Temperature 160 °C	6.0 % @Temperature 320 °F	ISO 527-1/-2
Tensile Modulus	3.00 GPa @Temperature 160 °C	435 ksi @Temperature 320 °F	ISO 527-1/-2
	5.60 GPa @Temperature 120 °C	812 ksi @Temperature 248 °F	Dry; ISO 527-1/-2
	10.0 GPa @Temperature 23.0 °C	1450 ksi @Temperature 73.4 °F	Dry; ISO 527-1/-2
	10.0 GPa @Temperature 23.0 °C	1450 ksi @Temperature 73.4 °F	Cond; ISO 527-1/-2
Flexural Strength	165 MPa	23900 psi	Cond; ISO 178
	185 MPa	26800 psi	Dry; ISO 178
Flexural Modulus	3.10 GPa @Temperature 160 °C	450 ksi @Temperature 320 °F	ISO 178
	5.40 GPa @Temperature 120 °C	783 ksi @Temperature 248 °F	ISO 178
	9.40 GPa @Temperature 23.0 °C	1360 ksi @Temperature 73.4 °F	Dry; ISO 178
	9.60 GPa @Temperature 23.0 °C	1390 ksi @Temperature 73.4 °F	Cond; ISO 178
Charpy Impact Unnotched	3.50 J/cm² @Temperature 23.0 °C	16.7 ft-lb/in² @Temperature 73.4 °F	Dry; ISO 179/1eU
	3.50 J/cm² @Temperature 23.0 °C	16.7 ft-lb/in² @Temperature 73.4 °F	Cond; ISO 179/1eU
Charpy Impact, Notched	0.360 J/cm² @Temperature 23.0 °C	1.71 ft-lb/in² @Temperature 73.4 °F	Cond; ISO 179/1eA
	0.400 J/cm² @Temperature 23.0 °C	1.90 ft-lb/in² @Temperature 73.4 °F	Dry; ISO 179/1eA

Electrical Properties	Metric	English	Comments
Dielectric Constant	3.78 @Frequency 1e+9 Hz	3.78 @Frequency 1e+9 Hz	Dry; IEC 60250
	3.85 @Frequency 1e+9 Hz	3.85 @Frequency 1e+9 Hz	Cond; IEC 60250

Thermal Properties	Metric	English	Comments
CTE, linear	60.0 µm/m-°C	33.3 µin/in-°F	Dry; ISO 11359-1/-2
CTE, linear, Parallel to Flow	18.0 µm/m-°C	10.0 µin/in-°F	Dry; ISO 11359-1/-2
Melting Point	325 °C	617 °F	10°C/min. Dry; ISO 11357-1/-3
Deflection Temperature at 1.8 MPa (264 psi)	285 °C	545 °F	Dry; ISO 75-1/-2
Flammability, UL94	HB @Thickness 3.00 mm	HB @Thickness 0.118 in	Dry; IEC 60695-11-10

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PDSM7908 / 291344

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