MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Ensinger PEI

Bakelite® PF 1110 Phenolic Molding Compound
Categories: Polymer; Thermoset; Phenolic; Phenolic, Novolac, Glass Filled
Material Notes: Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, very low coefficient of thermal expansion, highest resistance to pressure, high dimensional stability.

Applications: Thermally and mechanically highly stressed parts in automotive UTH; e.g. large format parts, engine attachments, insulating flanges, brake pistons, impellers, pulleys and pump parts.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 2.05 g/cc0.0741 lb/in³ISO 1183
Apparent Bulk Density 0.800 g/cc0.0289 lb/in³ISO 60
Linear Mold Shrinkage 0.0015 cm/cm0.0015 in/inInjection Molding. Post Shrinkage = 0.03%.; ISO 2577
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 120 MPa17400 psiISO 527 - 1/2
Tensile Modulus 26.0 GPa3770 ksiISO 527 - 1/2
 16.3 GPa
@Strain 0.1 %,
Temperature 150 °C		2360 ksi
@Strain 0.1 %,
Temperature 302 °F		no post cure; ISO 527 - 1/2
 21.3 GPa
@Strain 0.1 %,
Temperature 120 °C		3090 ksi
@Strain 0.1 %,
Temperature 248 °F		no post cure; ISO 527 - 1/2
 23.4 GPa
@Strain 0.1 %,
Temperature 80.0 °C		3390 ksi
@Strain 0.1 %,
Temperature 176 °F		no post cure; ISO 527 - 1/2
 26.1 GPa
@Strain 0.1 %,
Temperature 23.0 °C		3790 ksi
@Strain 0.1 %,
Temperature 73.4 °F		no post cure; ISO 527 - 1/2
 27.1 GPa
@Strain 0.1 %,
Temperature -40.0 °C		3930 ksi
@Strain 0.1 %,
Temperature -40.0 °F		no post cure; ISO 527 - 1/2
Flexural Strength 240 MPa34800 psiISO 178
Flexural Modulus 25.0 GPa3630 ksiISO 178
Compressive Strength 275 MPa39900 psiISO 604
Poissons Ratio 0.250.25no post cure
Shear Modulus 10.4 GPa1510 ksi
Charpy Impact Unnotched 1.30 J/cm²6.19 ft-lb/in²ISO 179-1 eU
Charpy Impact, Notched 0.400 J/cm²1.90 ft-lb/in²ISO 179-1eA
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+12 ohm-cm1.00e+12 ohm-cm
Surface Resistance 1.00e+11 ohm1.00e+11 ohm
Dielectric Constant 6.5
@Frequency 100 Hz		6.5
@Frequency 100 Hz
Dielectric Strength 27.5 kV/mm
@Thickness 1.00 mm		699 kV/in
@Thickness 0.0394 in		IEC 60243-P1
Dissipation Factor 0.050
@Frequency 100 Hz		0.050
@Frequency 100 Hz
Comparative Tracking Index 225 V225 V
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 11.0 µm/m-°C6.11 µin/in-°Fno post cure
CTE, linear, Transverse to Flow 11.0 µm/m-°C6.11 µin/in-°Fno post cure
Deflection Temperature at 8.0 MPa 195 °C383 °FISO 75-2
Flammability, UL94 V-0
@Thickness 0.800 mm		V-0
@Thickness 0.0315 in
 
Descriptive Properties
Water absorption (mg)724h / 23°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Bakelite® EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
Bakelite® EP 8413 Epoxy Molding Compound
Bakelite® MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength
Bakelite® PF 6510 Phenolic Molding Compound
Bakelite® PF 31 Phenolic Formaldehyde Resin, UL Listed

PBAKE981 / 192343

Proto3000 – 3D Engineering Solutions




Searches:   Advanced  •   Composition  •   Property  •   Material Type  •   Manufacturer  •   Trade Name  •   UNS Number
Other Links:   Advertising  •   Submit Data  •   Database Licensing  •   Web Design & Hosting  •   Trade Publications
Supplier List  •   Unit Converter  •   Reference  •   Links  •   Help  •   Contact Us  •   Site Map  •   FAQ  •   Home
 
Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.