Trelleborg Emerson & Cuming Eccobond® 57C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive

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Trelleborg Emerson & Cuming Eccobond® 57C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy, Electrically Conductive
Material Notes:	Emerson & Cuming 57C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Silver filled, electrically conductive, room temperature curing, epoxy adhesive. Good thermal conductivity. Convenient 1:1 mix ratio by weight or volume. Adheres to a wide variety of substrates. Recommended for use in applications where hot soldering is impractical. Mix ratio of 100:100. Cure Type: Room Temperature Bonding Type: Epoxy The Eccobond® product line is now a part of Henkel; this specific grade is discontinued.
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Physical Properties	Metric	English	Comments

Density	3.50 g/cc	0.126 lb/in³

Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	4.83 MPa	700 psi

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.00060 ohm-cm	0.00060 ohm-cm

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	90.0 °C	194 °F
Minimum Service Temperature, Air	-40.0 °C	-40.0 °F

Processing Properties	Metric	English	Comments
Cure Time	45.0 min @Temperature 100 °C	0.750 hour @Temperature 212 °F
	180 min @Temperature 65.0 °C	3.00 hour @Temperature 149 °F
	960 min @Temperature 25.0 °C	16.0 hour @Temperature 77.0 °F

Descriptive Properties
Color	Silver
Viscosity	Thixotropic Paste (Mixed, 25°C)

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