Metlbond 2550 is a 350°F (177°C) cure, 440° (227°C) post-cure, modified BMI film adhesive with good high-temperature adhesive properties for bonding composites, metals and sandwich structures. Features & Benefits: - Service temperature of -67 to 450°F (-55 to 232°C) dry / 375°F (191°C) wet
- Six-fold toughness increase over first generation BMI adhesives
- Outstanding bond strength with composites and metals
- Controlled flow for sandwich structural bonding
- Epoxy-like processing with 21+ days shop life at 75°F (24°C)
- No volatiles evolved during cure
- Co-cures with Cytec’s BMI composite systems
- Reticulation capability with unsupported variant
Applications: - Honeycomb sandwich bonding
- Metal-to-metal bonding
- Metal-to-composite bonding
- Composite-to-composite bonding
Information provided by Cytec, subsequently acquired by Solvay. |