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USP Class VI adhesives

SABIC LEXAN™ Healthcare HPS1 PC (Europe)
Categories: Polymer; Thermoplastic; Polycarbonate (PC); Polycarbonate, Gamma Radiation Resistant

Material Notes: LEXAN HPS1 is a high flow polycarbonate (PC) with an MVR (300°C/1.2kg) of 23. This is a biocompatible (ISO10993 or USP Class VI) grade for medical devices and pharmaceutical applications. It is gamma and e-beam sterilizable, contains mold release and adheres to our healthcare management of change policy.

Information provided by SABIC

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.20 g/cc0.0434 lb/in³ISO 1183
Water Absorption 0.35 %0.35 %23°C/sat; ISO 62
Moisture Absorption 0.150 %0.150 %23°C / 50% RH; ISO 62
Linear Mold Shrinkage, Flow 0.0050 - 0.0070 cm/cm0.0050 - 0.0070 in/inSABIC method
Melt Flow 23 g/10 min
@Load 1.20 kg,
Temperature 300 °C
23 g/10 min
@Load 2.65 lb,
Temperature 572 °F
cm³/10 min; ISO 1133
 
Mechanical PropertiesMetricEnglishComments
Ball Indentation Hardness 95.0 MPa13800 psiISO 2039-1
Tensile Strength at Break 50.0 MPa7250 psi50 mm/min; ISO 527
Tensile Strength, Yield 63.0 MPa9140 psi50 mm/min; ISO 527
Elongation at Break 70 %70 %50 mm/min; ISO 527
Elongation at Yield 6.0 %6.0 %50 mm/min; ISO 527
Tensile Modulus 2.35 GPa341 ksi1mm/min; ISO 527
Flexural Yield Strength 90.0 MPa13100 psi2 mm/min; ISO 178
Flexural Modulus 2.30 GPa334 ksi2 mm/min; ISO 178
Izod Impact, Notched (ISO) 60.0 kJ/m²28.6 ft-lb/in²80*10*3; ISO 180/1A
 10.0 kJ/m²
@Temperature -30.0 °C
4.76 ft-lb/in²
@Temperature -22.0 °F
80*10*3; ISO 180/1A
Izod Impact, Unnotched (ISO) NBNB80*10*3; ISO 180/1U
 NB
@Temperature -30.0 °C
NB
@Temperature -22.0 °F
80*10*3; ISO 180/1U
Charpy Impact Unnotched NBNBEdgew 80*10*3 sp=62mm; ISO 179/1eU
 NB
@Temperature -30.0 °C
NB
@Temperature -22.0 °F
Edgew 80*10*3 sp=62mm; ISO 179/1eU
Charpy Impact, Notched 6.00 J/cm²28.6 ft-lb/in²Edgew 80*10*3 sp=62mm; ISO 179/1eA
 1.50 J/cm²
@Temperature -30.0 °C
7.14 ft-lb/in²
@Temperature -22.0 °F
Edgew 80*10*3 sp=62mm; ISO 179/1eA
Taber Abrasion, mg/1000 Cycles 3232CS-17, 1 kg; SABIC method
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+15 ohm-cm>= 1.00e+15 ohm-cmIEC 60093
Surface Resistance >= 1.00e+15 ohm>= 1.00e+15 ohmROA; IEC 60093
Dielectric Constant  2.7
@Frequency 1e+6 Hz
2.7
@Frequency 1e+6 Hz
IEC 60250
 2.7
@Frequency 50.0 - 60.0 Hz
2.7
@Frequency 50.0 - 60.0 Hz
IEC 60250
Dielectric Strength 17.0 kV/mm
@Thickness 3.20 mm
432 kV/in
@Thickness 0.126 in
in oil; IEC 60243-1
Dissipation Factor  0.0010
@Frequency 50.0 - 60.0 Hz
0.0010
@Frequency 50.0 - 60.0 Hz
IEC 60250
 0.010
@Frequency 1e+6 Hz
0.010
@Frequency 1e+6 Hz
IEC 60250
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 70.0 µm/m-°C
@Temperature 23.0 - 80.0 °C
38.9 µin/in-°F
@Temperature 73.4 - 176 °F
ISO 11359-2
Thermal Conductivity 0.200 W/m-K1.39 BTU-in/hr-ft²-°FISO 8302
Hot Ball Pressure Test 125 °C257 °FIEC 60695-10-2
Deflection Temperature at 0.46 MPa (66 psi) 133 °C271 °FEdgew 120*10*4 sp=100mm; ISO 75/Be
Deflection Temperature at 1.8 MPa (264 psi) 121 °C250 °F1.8 MPa Edgew 120*10*4 sp=100mm; ISO 75/Ae
Vicat Softening Point 139 °C282 °FRate B/50; ISO 306
 140 °C284 °FRate B/120; ISO 306
Oxygen Index 25 %25 %ISO 4589
Glow Wire Test 850 °C
@Thickness 1.00 mm
1560 °F
@Thickness 0.0394 in
IEC 60695-2-12
 
Processing PropertiesMetricEnglishComments
Processing Temperature 60.0 - 80.0 °C140 - 176 °FHopper Temperature
Nozzle Temperature 270 - 290 °C518 - 554 °FInjection Molding
Zone 1 260 - 280 °C500 - 536 °F
Zone 2 270 - 290 °C518 - 554 °F
Zone 3 280 - 300 °C536 - 572 °F
Melt Temperature 280 - 300 °C536 - 572 °F
Mold Temperature 80.0 - 100 °C176 - 212 °F
Drying Temperature 120 °C248 °FInjection Molding
Dry Time 2.00 - 4.00 hour2.00 - 4.00 hourInjection Molding
Moisture Content 0.020 %0.020 %
 
Compliance PropertiesMetricEnglishComments
USP Class VI YesYes

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PSABI10682 / 244149

USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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